Internal Interrupts are used to respond to asynchronous requests from a certain part of themicrocontroller that needs to be serviced. Each peripheral in the TriCore as well as theBus Control Unit, the Debug Unit, the Peripheral Control Processor (PCP) and the CPUitself can generate an Interrupt Request.So what is an external Interrupt?An external Interrupt is something alike as the internal Interrupt. The difference is that anexternal Interrupt request is caused by an external event. Normally this would be a pulseon Port0 or Port1, but it can be even a signal from the input buffer of the SSC, indicatingthat a service is requested.The User’s Manual does not explain this aspect in detail so this ApNote will explain themost common form of an external Interrupt request. This ApNote will show that there is aneasy way to react on a pulse on Port0 or Port1 and to create with this impulse an InterruptService Request. Later in the second part of the document, you can find hints on how todebounce impulses to enable the use of a simple switch as the input device.Note: You will find additional information on how to setup the Interrupt System in theApNote “First steps through the TriCore Interrupt System” (AP3222xx)1. It would gobeyond the scope of this document to explain this here, but you will find selfexplanatoryexamples later on.
上传时间： 2013-10-27
上传用户：zhangyigenius
The PL2303 USB to Serial adapter is your smart and convenient accessory forconnecting RS-232 serial devices to your USB-equipped Windows host computer. Itprovides a bridge connection with a standard DB 9-pin male serial port connector inone end and a standard Type-A USB plug connector on the other end. You simplyattach the serial device onto the serial port of the cable and plug the USB connectorinto your PC USB port. It allows a simple and easy way of adding serial connectionsto your PC without having to go thru inserting a serial card and traditional portconfiguration.This USB to Serial adapter is ideal for connecting modems, cellular phones, PDAs,digital cameras, card readers and other serial devices to your computer. It providesserial connections up to 1Mbps of data transfer rate. And since USB does not requireany IRQ resource, more devices can be attached to the system without the previoushassles of device and resource conflicts.Finally, the PL-2303 USB to Serial adapter is a fully USB Specification compliantdevice and therefore supports advanced power management such as suspend andresume operations as well as remote wakeup. The PL-2303 USB Serial cable adapteris designed to work on all Windows operating systems.
上传时间： 2013-11-01
上传用户：ghostparker
WP409利用Xilinx FPGA打造出高端比特精度和周期精度浮点DSP算法实现方案： High-Level Implementation of Bit- and Cycle-Accurate Floating-Point DSP Algorithms with Xilinx FPGAs
上传时间： 2013-11-07
上传用户：defghi010
Vishay新型功率MOSFET采用反向导引TO-252DPAK封装
上传时间： 2013-11-09
上传用户：immanuel2006
ADS to MDK 转换例程由西安毕博制作的MDK指导视频，下载后打开Realview mdk1.htm页面即可播放，内容包括：模拟仿真、开发环境的建立、启动代码概述等，是您尽快上手MDK的好工具
上传时间： 2013-12-21
上传用户：dalidala
mm to mil tool,mm to mil tool_mm转mil转换工具
上传时间： 2013-10-31
上传用户：515414293
mm to mil tool,mm to mil tool_mm转mil转换工具
上传时间： 2013-11-14
上传用户：crazyer
WP409利用Xilinx FPGA打造出高端比特精度和周期精度浮点DSP算法实现方案： High-Level Implementation of Bit- and Cycle-Accurate Floating-Point DSP Algorithms with Xilinx FPGAs
上传时间： 2013-10-21
上传用户：huql11633
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. POSITIVE LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之POSITIVE LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上传时间： 2013-11-17
上传用户：cjf0304
USB TO RS232 RS485 UART转接板电路原理图
上传时间： 2013-10-22
上传用户：macarco
