·详细说明：数字图像处理与分析-刘定生老师， 非常好的讲述数字图像处理的课件，包括所有基本的图像处理知识,Image processing ang analysis by Teacher LiuDingsheng, very good for you to study the knowledge of image processing
上传时间： 2013-04-24
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1.an fpga implementation of the image space reconstruction algorithm for hyperspectral imaging analysis\r\n2. fpga implemention of a median filter\r\n3. fpga implementation of digital filters\r\n4.hardware acceleration of edge detection algorithm on fpgas
标签： implementation reconstruction hyperspectral algorithm
上传时间： 2013-08-07
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Designers of signal receiver systems often need to performcascaded chain analysis of system performancefrom the antenna all the way to the ADC. Noise is a criticalparameter in the chain analysis because it limits theoverall sensitivity of the receiver. An application’s noiserequirement has a signifi cant infl uence on the systemtopology, since the choice of topology strives to optimizethe overall signal-to-noise ratio, dynamic range andseveral other parameters. One problem in noise calculationsis translating between the various units used by thecomponents in the chain: namely the RF, IF/baseband,and digital (ADC) sections of the circuit.
上传时间： 2014-12-05
上传用户：cylnpy
高速数字系统设计下载pdf:High-Speed Digital SystemDesign—A Handbook ofInterconnect Theory and DesignPracticesStephen H. HallGarrett W. HallJames A. McCallA Wiley-Interscience Publication JOHN WILEY & SONS, INC.New York • Chichester • Weinheim • Brisbane • Singapore • TorontoCopyright © 2000 by John Wiley & Sons, Inc.speeddigital systems at the platform level. The book walks the reader through everyrequired concept, from basic transmission line theory to digital timing analysis, high-speedmeasurement techniques, as well as many other topics. In doing so, a unique balancebetween theory and practical applications is achieved that will allow the reader not only tounderstand the nature of the problem, but also provide practical guidance to the solution.The level of theoretical understanding is such that the reader will be equipped to see beyondthe immediate practical application and solve problems not contained within these pages.Much of the information in this book has not been needed in past digital designs but isabsolutely necessary today. Most of the information covered here is not covered in standardcollege curricula, at least not in its focus on digital design, which is arguably one of the mostsignificant industries in electrical engineering.The focus of this book is on the design of robust high-volume, high-speed digital productssuch as computer systems, with particular attention paid to computer busses. However, thetheory presented is applicable to any high-speed digital system. All of the techniquescovered in this book have been applied in industry to actual digital products that have beensuccessfully produced and sold in high volume.Practicing engineers and graduate and undergraduate students who have completed basicelectromagnetic or microwave design classes are equipped to fully comprehend the theorypresented in this book. At a practical level, however, basic circuit theory is all thebackground required to apply the formulas in this book.
上传时间： 2013-10-26
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I.1 IntroductionI.2 Analog Integrated Circuit DesignI.3 Technology OverviewI.4 NotationI.5 Analog Circuit Analysis Techniques
上传时间： 2013-10-29
上传用户：jokey075
One of the strengths of Synplify is the Finite State Machine compiler. This is a powerfulfeature that not only has the ability to automatically detect state machines in the sourcecode, and implement them with either sequential, gray, or one-hot encoding. But alsoperform a reachability analysis to determine all the states that could possibly bereached, and optimize away all states and transition logic that can not be reached.Thus, producing a highly optimal final implementation of the state machine.
标签： Synplicity Machine Verilog Design
上传时间： 2013-10-23
上传用户：司令部正军级
第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2014-04-18
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磁芯电感器的谐波失真分析 摘 要：简述了改进铁氧体软磁材料比损耗系数和磁滞常数ηB，从而降低总谐波失真THD的历史过程，分析了诸多因数对谐波测量的影响，提出了磁心性能的调控方向。 关键词：比损耗系数， 磁滞常数ηB ，直流偏置特性DC-Bias，总谐波失真THD Analysis on THD of the fer rite co res u se d i n i nductancShi Yan Nanjing Finemag Technology Co. Ltd., Nanjing 210033 Abstract: Histrory of decreasing THD by improving the ratio loss coefficient and hysteresis constant of soft magnetic ferrite is briefly narrated. The effect of many factors which affect the harmonic wave testing is analysed. The way of improving the performance of ferrite cores is put forward. Key words: ratio loss coefficient，hysteresis constant，DC-Bias，THD 近年来，变压器生产厂家和软磁铁氧体生产厂家，在电感器和变压器产品的总谐波失真指标控制上，进行了深入的探讨和广泛的合作，逐步弄清了一些似是而非的问题。从工艺技术上采取了不少有效措施，促进了质量问题的迅速解决。本文将就此热门话题作一些粗浅探讨。 一、 历史回顾 总谐波失真（Total harmonic distortion） ，简称THD，并不是什么新的概念，早在几十年前的载波通信技术中就已有严格要求<1>。1978年邮电部公布的标准YD/Z17－78“载波用铁氧体罐形磁心”中，规定了高μQ材料制作的无中心柱配对罐形磁心详细的测试电路和方法。如图一电路所示，利用LC组成的150KHz低通滤波器在高电平输入的情况下测量磁心产生的非线性失真。这种相对比较的实用方法，专用于无中心柱配对罐形磁心的谐波衰耗测试。 这种磁心主要用于载波电报、电话设备的遥测振荡器和线路放大器系统，其非线性失真有很严格的要求。 图中 ZD —— QF867 型阻容式载频振荡器，输出阻抗 150Ω， Ld47 —— 47KHz 低通滤波器，阻抗 150Ω，阻带衰耗大于61dB， Lg88 ——并联高低通滤波器，阻抗 150Ω，三次谐波衰耗大于61dB Ld88 ——并联高低通滤波器，阻抗 150Ω，三次谐波衰耗大于61dB FD —— 30～50KHz 放大器， 阻抗 150Ω， 增益不小于 43 dB，三次谐波衰耗b3(0)≥91 dB, DP —— Qp373 选频电平表，输入高阻抗， L ——被测无心罐形磁心及线圈， C ——聚苯乙烯薄膜电容器CMO-100V-707APF±0.5%,二只。 测量时，所配用线圈应用丝包铜电磁线SQJ9×0.12(JB661-75)在直径为16.1mm的线架上绕制 120 匝， （线架为一格） ， 其空心电感值为 318μH（误差1％） 被测磁心配对安装好后，先调节振荡器频率为 36.6～40KHz， 使输出电平值为+17.4 dB， 即选频表在 22′端子测得的主波电平 （P2）为+17.4 dB，然后在33′端子处测得输出的三次谐波电平（P3）， 则三次谐波衰耗值为：b3(+2)= P2+S+ P3 式中：S 为放大器增益dB 从以往的资料引证， 就可以发现谐波失真的测量是一项很精细的工作，其中测量系统的高、低通滤波器，信号源和放大器本身的三次谐波衰耗控制很严，阻抗必须匹配，薄膜电容器的非线性也有相应要求。滤波器的电感全由不带任何磁介质的大空心线圈绕成，以保证本身的“洁净” ，不至于造成对磁心分选的误判。 为了满足多路通信整机的小型化和稳定性要求， 必须生产低损耗高稳定磁心。上世纪 70 年代初，1409 所和四机部、邮电部各厂，从工艺上改变了推板空气窑烧结，出窑后经真空罐冷却的落后方式，改用真空炉，并控制烧结、冷却气氛。技术上采用共沉淀法攻关试制出了μQ乘积 60 万和 100 万的低损耗高稳定材料，在此基础上，还实现了高μ7000～10000材料的突破，从而大大缩短了与国外企业的技术差异。当时正处于通信技术由FDM（频率划分调制）向PCM（脉冲编码调制） 转换时期， 日本人明石雅夫发表了μQ乘积125 万为 0.8×10 ，100KHz）的超优铁氧体材料<3>，其磁滞系数降为优铁
上传时间： 2014-12-24
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Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上传时间： 2013-11-10
上传用户：1595690
Abstract: Electrolytic capacitors are notorious for short lifetimes in high-temperature applications such asLED light bulbs. The careful selection of these devices with proper interpretation of their specifications isessential to ensure that they do not compromise the life of the end product. This application notediscusses this problem with electrolytic capacitors in LED light bulbs and provides an analysis that showshow it is possible to use electrolytics in such products.
上传时间： 2013-11-17
上传用户：asdfasdfd
