中文版详情浏览：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
标签： UltraScale Xilinx 架构
上传时间： 2013-11-21
上传用户：wxqman
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
Today’s digital systems combine a myriad of chips with different voltage configurations.Designers must interface 2.5V processors with 3.3V memories—both RAM and ROM—as wellas 5V buses and multiple peripheral chips. Each chip has specific power supply needs. CPLDsare ideal for handling the multi-voltage interfacing, but do require forethought to ensure correctoperation.
上传时间： 2013-11-10
上传用户：yy_cn
数字与模拟电路设计技巧IC与LSI的功能大幅提升使得高压电路与电力电路除外，几乎所有的电路都是由半导体组件所构成，虽然半导体组件高速、高频化时会有EMI的困扰，不过为了充分发挥半导体组件应有的性能，电路板设计与封装技术仍具有决定性的影响。 模拟与数字技术的融合由于IC与LSI半导体本身的高速化，同时为了使机器达到正常动作的目的，因此技术上的跨越竞争越来越激烈。虽然构成系统的电路未必有clock设计，但是毫无疑问的是系统的可靠度是建立在电子组件的选用、封装技术、电路设计与成本，以及如何防止噪讯的产生与噪讯外漏等综合考虑。机器小型化、高速化、多功能化使得低频/高频、大功率信号/小功率信号、高输出阻抗/低输出阻抗、大电流/小电流、模拟/数字电路，经常出现在同一个高封装密度电路板，设计者身处如此的环境必需面对前所未有的设计思维挑战，例如高稳定性电路与吵杂(noisy)性电路为邻时，如果未将噪讯入侵高稳定性电路的对策视为设计重点，事后反复的设计变更往往成为无解的梦魇。模拟电路与高速数字电路混合设计也是如此，假设微小模拟信号增幅后再将full scale 5V的模拟信号，利用10bit A/D转换器转换成数字信号，由于分割幅宽祇有4.9mV，因此要正确读取该电压level并非易事，结果造成10bit以上的A/D转换器面临无法顺利运作的窘境。另一典型实例是使用示波器量测某数字电路基板两点相隔10cm的ground电位，理论上ground电位应该是零，然而实际上却可观测到4.9mV数倍甚至数十倍的脉冲噪讯(pulse noise)，如果该电位差是由模拟与数字混合电路的grand所造成的话，要测得4.9 mV的信号根本是不可能的事情，也就是说为了使模拟与数字混合电路顺利动作，必需在封装与电路设计有相对的对策，尤其是数字电路switching时，ground vance noise不会入侵analogue ground的防护对策，同时还需充分检讨各电路产生的电流回路(route)与电流大小，依此结果排除各种可能的干扰因素。以上介绍的实例都是设计模拟与数字混合电路时经常遇到的瓶颈，如果是设计12bit以上A/D转换器时，它的困难度会更加复杂。
上传时间： 2014-02-12
上传用户：wenyuoo
The data plane of the reference design consists of a configurable multi-channel XBERT modulethat generates and checks high-speed serial data transmitted and received by the MGTs. Eachchannel in the XBERT module consists of two MGTs (MGTA and MGTB), which physicallyoccupy one MGT tile in the Virtex-4 FPGA. Each MGT has its own pattern checker, but bothMGTs in a channel share the same pattern generator. Each channel can load a differentpattern. The MGT serial rate depends on the reference clock frequency and the internal PMAdivider settings. The reference design can be scaled anywhere from one channel (two MGTs)to twelve channels (twenty-four MGTs).
上传时间： 2013-12-25
上传用户：jkhjkh1982
ARM通讯 H-JTAG 是一款简单易用的的调试代理软件，功能和流行的MULTI-ICE 类似。H-JTAG 包括两个工具软件：H-JTAG SERVER 和H-FLASHER。其中，H-JTAG SERVER 实现调试代理的功能，而H-FLASHER则实现了FLASH 烧写的功能。H-JTAG 的基本结构如下图1-1所示。 H-JTAG支持所有基于ARM7 和ARM9的芯片的调试，并且支持大多数主流的ARM调试软件，如ADS、RVDS、IAR 和KEIL。通过灵活的接口配置，H-JTAG 可以支持WIGGLER，SDT-JTAG 和用户自定义的各种JTAG 调试小板。同时，附带的H-FLASHER 烧写软件还支持常用片内片外FLASH 的烧写。使用H-JTAG，用户能够方便的搭建一个简单易用的ARM 调试开发平台。H-JTAG 的功能和特定总结如下： 1. 支持 RDI 1.5.0 以及 1.5.1； 2. 支持所有ARM7 以及 ARM9 芯片； 3. 支持 THUMB 以及ARM 指令； 4. 支持 LITTLE-ENDIAN 以及 BIG-ENDIAN； 5. 支持 SEMIHOSTING； 6. 支持 WIGGLER， SDT-JTAG和用户自定义JTAG调试板； 7. 支持 WINDOWS 9.X/NT/2000/XP； 8．支持常用FLASH 芯片的编程烧写； 9. 支持LPC2000 和AT91SAM 片内FLASH 的自动下载；
上传时间： 2013-11-19
上传用户：水中浮云
XMail is an Internet and intranet mail server featuring an SMTP server, POP3 server, finger server, multiple domains, no need for users to have a real system account, SMTP relay checking, RBL/RSS/ORBS/DUL and custom ( IP based and address based ) spam protection, SMTP authentication ( PLAIN LOGIN CRAM-MD5 POP3-before-SMTP and custom ), a POP3 account syncronizer with external POP3 accounts, account aliases, domain aliases, custom mail processing, direct mail files delivery, custom mail filters, mailing lists, remote administration, custom mail exchangers, logging, and multi-platform code. XMail sources compile under GNU/Linux, FreeBSD, OpenBSD, NetBSD, OSX, Solaris and NT/2K/XP.
标签： server featuring Internet intranet
上传时间： 2015-01-12
上传用户：asddsd
来自《VC6.0可视化编程》的源码，适用于初学者。 这是第一章，关于multi windows 的代码
上传时间： 2013-12-20
上传用户：TF2015
linux下的gdbserver源码，供multi-ice调试ARM处理器
上传时间： 2013-12-24
上传用户：txfyddz
The practice of enterprise application development has benefited from the emergence of many new enabling technologies. Multi-tiered object-oriented platforms, such as Java and .NET, have become commonplace.
标签： application development enterprise benefited
上传时间： 2015-03-11
上传用户：aig85
