S32K1xx Series Reference Manual 用户手册--2029页 Supports S32K116, S32K118, S32K142, S32K144, S32K146, and S32K148S32K是一款符合AEC-Q100规范、基于32位ARM Cortex-M4F和Cortex-M0+内核的MCU，适用于通用汽车和高可靠性工业应用。The S32K1xx product series further extends the highly scalable portfolio of Arm® Cortex®-M0+/M4F MCUs in the automotive industry. It builds on the legacy of the KEA series, while introducing higher memory options alongside a richer peripheral set extending capability into a variety of automotive applications. With a 2.70–5.5 V supply and focus on automotive environment robustness, the S32K product series devices are well suited to a wide range of applications in electrically harsh environments, and are optimized for cost-sensitive applications offering low pin-count options. The S32K product series offers a broad range of memory, peripherals, and package options. It shares common peripherals and pin counts, allowing developers to migrate easily within an MCU family or among the MCU families to take advantage of more memory or feature integration. This scalability allows developers to use the S32K product series as the standard for their end product platforms, maximizing hardware and software reuse and reducing time to market
标签： S32K116 S32K118 S32K142 S32K144
上传时间： 2022-04-16
上传用户：jason_vip1
意法半导体STM8系列参考手册Program memory: 8 Kbyte Flash memory; dataretention 20 years at 55 °C after 100 cycles• RAM: 1 Kbyte• Data memory: 128 bytes true data EEPROM;endurance up to 100 k write/erase cycles
标签： stm8
上传时间： 2022-04-27
上传用户：zhaiyawei
This manual documents the Microcontroller profile of version 7 of the ARM® Architecture, the ARMv7-M architecture profile. For short definitions of all the ARMv7 profiles see About the ARMv7 architecture, and architecture profiles on page A1-20.ARMv7 is documented as a set of architecture profiles. The profiles are defined as follows: ARMv7-A The application profile for systems supporting the ARM and Thumb instruction sets, and requiring virtual address support in the memory management model. ARMv7-R The realtime profile for systems supporting the ARM and Thumb instruction sets, and requiring physical address only support in the memory management model ARMv7-M The microcontroller profile for systems supporting only the Thumb instruction set, and where overall size and deterministic operation for an implementation are more important than absolute performance. While profiles were formally introduced with the ARMv7 development, the A-profile and R-profile have implicitly existed in earlier versions, associated with the Virtual Memory System Architecture (VMSA) and Protected Memory System Architecture (PMSA) respectively.
标签： arm
上传时间： 2022-06-02
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ATS2819/ATS2819P标准应用方案主要分为以下功能模块：Power Supply，BlueTooth，Audio Input/Output（包括codec、I2C、SPDIF），FM Receiver，disaplay（LED&LCD），USB，SPI NOR Flash Memory，SD/MMC/MS Card等。1.2原理图设计总体原则1原理图设计需要按照方案规格的要求实现各项硬件功能，尽量避免功能模块相互间的资源冲突。如果存在I/O复用，接收复用等情况，除了需注意检查I/O上电状态，接口时序等，还需要注意复用的SIO工作频率与工作电压域是否符合要求(如WIO)，确保功能设计正确实现。2原理图设计要求性能达到要求。如稳定性，启动电压，功耗，ESD，EMI等。要注意检查模块电源开关状态，选择的原件标称及精度、材质，接口保护元件和EMI滤波器等。3系统时钟26MHZ，要求CL为7~9PF，精度为+-10PPM。这样才能保证系统能正常工作。4当设计PCB受限于模具大小时，各个模块无法保证均能得到最优的布局布线(如滤波电容要求靠近IC、走线上要求尽量少的过孔与尽可能短的走线)。因为在此给出一个模块优先级以供设计人员参考，从而提高方案设计的效率，增加一版work的可行性。将优先级以阿拉伯数据排列
上传时间： 2022-06-07
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RK3288资料说明： DDR3 方案采用 4x16bit、 2x32bit 等模板； LPDDR2 方案采用 2 x 32bit（168pin）、 1 x 32bit x 2channel（pop216pin）、 1x32bitx 2channel（pop220pin） 等模板； LPDDR3 方案采用 2 x 32bit（178pin）模板 PMIC 方案采用 RT5C620(单节电池)、 ACT8846（双节电池）； Memory 默认为 eMMC Flash，兼容 Nand Flash 及 tSD 的设计； TP 包括 COF 及三种 COB 接法； 显示包括 eDP、单 MIPI、双 MIPI、 LVDS 四种兼容设计； 3G 包括 3G-UNA（DS 7.2Mbps）、 3G-UNA LITE（DS 14.4Mbps） 两种模组兼容； Audio 包括 ES8323（低成本）、 ALC5631、 ALC3224（BT 语音）三种兼容； WIFI 兼容 AP6XXX 各模开发包包含以下几部分资料1、RK3288原厂参考原理图，DSN原始文档。2、RK3288发布原理图修改记录、规格书等3、RK3288原厂参考的DDR模板，包含DSN原理图和pads PCB4、RK3288 PCB库文件总的来说，拿到这份资料之后即可进行RK3288的硬件开发设计，可以画原理图、PCB。
上传时间： 2022-06-12
上传用户：bluedrops
PIC XC8 V1.41 PRO版，编译器破解文件，将附件文件覆盖编译器bin目录下原文件即可。你懂的。。。。。。。编译前把编译选项的Free改成PRO和谐文件在MPLAB X IDE v5.00版本测试成功清除已成功 (总时间： 10ms)make -f nbproject/Makefile-default.mk SUBPROJECTS= .build-confmake -f nbproject/Makefile-default.mk dist/default/production/KEY_V1.X.production.hexMicrochip MPLAB XC8 C Compiler (PRO Mode) V1.41Build date: Jan 24 2017Part Support Version: 1.41Copyright (C) 2017 Microchip Technology Inc.Memory Summary: Program space used 2A9h ( 681) of 1000h words ( 16.6%) Data space used 4Dh ( 77) of 100h bytes ( 30.1%) EEPROM space used 0h ( 0) of 100h bytes ( 0.0%) Data stack space used 0h ( 0) of AEh bytes ( 0.0%) Configuration bits used 2h ( 2) of 2h words (100.0%) ID Location space used 0h ( 0) of 4h bytes ( 0.0%)编译已成功 (总时间： 2s)正在加载代码...加载完成
标签： XC8
上传时间： 2022-06-21
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pcie（PCI-Express）处理层协议中文详解处理层协议（transaction Layer specification）◆TLP概况。◆寻址定位和路由导向。◆i/o，.memory，configuration，message request、completion 详解。◆请求和响应处理机制。◆virtual channel（ve）Mechanism虚拟通道机制。◆data integrity 数据完整性。一.TLP概况处理层（transaction Layer specification）是请求和响应信息形成的基础。包括四种地址空间，三种处理类型，从下图可以看出在transaction Layer中形成的包的基本概括。一类是对io口和memory的读写包（TLPS:transaction Layers packages），另一类是对配置寄存器的读写设置包，还有一类是信息包，描述通信状态，作为事件的信号告知用户。对memory的读写包分为读请求包和响应包、写请求包（不需要存储器的响应包）。而io类型的读写请求都需要返回I/O口的响应包，
标签： pcie
上传时间： 2022-06-30
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1. General Description BL-M3362NS1 product is designed base on Broadcom BCM43362 chipset. It operates at 2.4GHz band and supports IEEE802.11b/g/n 1T1Rwith wireless data rate up to 72.2Mbps. It supports IEEE802.11isafety protocol, along with IEEE802.11e standard service quality. It supports standard interfaces SDIOV2.0(50 MHz,4-bit and1-bit) and generic SPI(up to 50 MHz), Integrated ARM Cortex?-M3 CPUwith on-chip memory enables running IEEE802.11 firmware that can be field-upgraded with future features.2. The range of applying Imaging platforms(printers, digital still cameras, digital picture frames)Consumer electronic devices(DTV, DVDplayers, Blu-ray players. etc.)Gaming platforms Carinformation MiFi/Mobile Routes Smart PAD Set-TopBoxes
标签： wifi
上传时间： 2022-07-04
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这一讲中将介绍Keil提供各种窗口如输出窗口、观察窗口、存储器窗口、反汇编窗口、串行窗口等的用途，以及这些窗口的使用方法，并通过实例介绍这些窗口在调试中的使用。一、程序调试时的常用窗口Keil软件在调试程序时提供了多个窗口，主要包括输出窗口（Output Windows）、观察窗口（Watch&Call Statck Windows）、存储器窗口（Memory Window）、反汇编窗口（Dissambly Window）串行窗口（Serial Window）等。进入调试模式后，可以通过菜单View下的相应命令打开或关闭这些窗口。图1是输出窗口、观察窗口和存储器窗口，各窗口的大小可以使用鼠标调整。进入调试程序后，输出窗口自动切换到Command页。该页用于输入调试命令和输出调试信息。对于初学者，可以暂不学习调试命令的使用方法。
上传时间： 2022-07-22
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The GD32F103xx device is a 32-bit general-purpose microcontroller based on the ARM?Cortex?-M3 RISC core with best ratio in terms of processing power, reduced power consumption and peripheral set. The Cortex?-M3 is a next generation processor core whichis tightly coupled with a Nested Vectored Interrupt Controller (NVIC), SysTick timer and advanced debug support.The GD32F103xx device incorporates the ARM ' Cortex?-M3 32-bit processor core operating at 108 MHz frequency with Flash accesses zero wait states to obtain maximumefficiency. It provides up to 3 MB on-chip Flash memory and up to 96 KB SRAM memory. An extensive range of enhanced I/Os and peripherals connected to two APB buses. The devices offer up to three 12-bit ADCs, up to two 12-bit DACs, up to ten general-purpose
标签： gd32f103
上传时间： 2022-07-23
上传用户：aben
