Orcad LAYOUT User s Guide
上传时间: 2017-06-08
上传用户:dragonhaixm
REALTEK公司RTL8110C网卡芯片的PCB LAYOUT参考设计,非常详尽的说明网卡类芯片的布局和设计原则和方法
上传时间: 2013-12-09
上传用户:tb_6877751
LAYOUT上课材料,台湾资料,很现实,很使用的,介绍当今LAYOUT的具体现状的资料。
上传时间: 2014-01-13
上传用户:huannan88
This is the Ready project caller Id based on the Atmel Chip 8051... PCB LAYOUT is also given in this file
上传时间: 2017-08-29
上传用户:杜莹12345
java LAYOUT implementation
标签: implementation LAYOUT java
上传时间: 2013-12-16
上传用户:372825274
pcb LAYOUT...............
上传时间: 2017-09-06
上传用户:拔丝土豆
sp files of simple current mirror LAYOUT
标签: current mirror LAYOUT simple
上传时间: 2017-09-20
上传用户:sdq_123
Sprint-LAYOUT,6.0,全整汉化版
标签: Sprint-LAYOUT 6.0 汉化版
上传时间: 2018-04-20
上传用户:jayi1109
Generalplus 无线充电5V方案 PCB LAYOUT Guide V1.GENERALPLUS 无线充电 5V 方案 PCB LAYOUT GUIDE ............................................................................................ 1 1 元件摆放 .......................................................................................................................................................................... 4 1.1 电源 VDD 电容要求 ...................................................................................................................................................... 4 1.2 MCU VDD 电容要求....................................................................................................................................................... 5 1.3 驱动部分......................................................................................................................................................................... 5 1.4 EMI 测试预留电容.......................................................................................................................................................... 6 2 电源 VDD 走线................................................................................................................................................................ 7 2.1 电源接口走线 ................................................................................................................................................................. 7 2.2 VPP 驱动线圈走线.......................................................................................................................................................... 7 2.3 NMOS 的 S 极................................................................................................................................................................. 9 2.4 VDD 走线过孔 .............................................................................................................................................................. 10 3 GND 走线........................................................................................................................................................................11 3.1 驱动电路的
标签: generalplus 无线充电
上传时间: 2021-10-20
上传用户:得之我幸78
This document provides general hardware and LAYOUTconsiderations and guidelines for hardware engineersimplementing a DDR3 memory subsystem.The rules and recommendations in this document serve as aninitial baseline for board designers to begin their specificimplementations, such as fly-by memory topology.
标签: ddr3
上传时间: 2021-11-21
上传用户: