微弱信号检测装置 四川理工学院 刘鹏飞、梁天德、曾学明 摘要： 本设计以TI的Launch Pad为核心板，采用锁相放大技术设计并制作了一套微弱信号检测装置，用以检测在强噪声背景下已知频率微弱正弦波信号的幅度值，并在液晶屏上数字显示出所测信号相应的幅度值。实验结果显示其抗干扰能力强，测量精度高。 关键词：强噪声；微弱信号；锁相放大；Launch Pad Abstract: This design is based on the Launch Pad of TI core board, using a lock-in amplifier technique designed and produced a weak signal detection device, to measure the known frequency sine wave signal amplitude values of the weak in the high noise background, and shows the measured signal amplitude of the corresponding value in the liquid crystal screen. Test results showed that it has high accuracy and strong anti-jamming capability. Keywords: weak signal detection; lock-in-amplifier; Launch Pad 1、引言 随着现代科学技术的发展，在科研与生产过程中人们越来越需要从复杂高强度的噪声中检测出有用的微弱信号，因此对微弱信号的检测成为当前科研的热点。微弱信号并不意味着信号幅度小，而是指被噪声淹没的信号，“微弱”也仅是相对于噪声而言的。只有在有效抑制噪声的条件下有选择的放大微弱信号的幅度，才能提取出有用信号。微弱信号检测技术的应用相当广泛，在生物医学、光学、电学、材料科学等相关领域显得愈发重要。 2、方案论证 针对微弱信号的检测的方法有很多，比如滤波法、取样积分器、锁相放大器等。下面就针对这几种方法做一简要说明。 方案一：滤波法。 在大部分的检测仪器中都要用到滤波方法对模拟信号进行一定的处理，例如隔离直流分量，改善信号波形，防止离散化时的波形混叠，克服噪声的不利影响，提高信噪比等。常用的噪声滤波器有：带通、带阻、高通、低通等。但是滤波方法检测信号不能用于信号频谱与噪声频谱重叠的情况，有其局限性。虽然可以对滤波器的通频带进行调节，但其噪声抑制能力有限，同时其准确性与稳定性将大打折扣。
上传时间： 2013-11-04
上传用户：lty6899826
为了提高数字水印抗击各种图像攻击的性能和保持图像的稳健性和不可见性，提出了一种基于离散小波变换（DWT），SVD（singular value decomposition）奇异值分解水印图像和原始载体图像的离散余弦变换（DCT）的自适应水印嵌入算法，主要是将水印图像的两次小波变换后的低频分量潜入到原始图像分块经过SVD分解的S分量矩阵中，同时根据图像的JPEG压缩比的不同计算各个图像块的水印调节因子。实验证明该算法在抗击JPEG压缩、中值滤波、加噪等均具有很好的鲁棒性，嵌入后的图像的PSNR达到38，具有良好的视觉掩蔽性
标签： 数字水印算法
上传时间： 2013-10-09
上传用户：ca05991270
Abstract: Most magnetic read head data sheets do not fully specify the frequency-dependent components andare often vague when specifying other key parameters. In some cases, the specifications of two very similarheads from two different manufacturers might be quite different in terms of parameters specified and omitted.The limitations in the data sheets make designing an optimum card reading system unnecessarily difficult andtime consuming. This document outlines a strategy to overcome the above shortcomings and offers guidelinesto overcome the noise issues.
上传时间： 2013-11-13
上传用户：dysyase
多反馈滤波器是一种流行的滤波器结构，以运算放大器作为积分器，如图1所示。因而，其传递函数对运算放大器参数的依赖度高于Sallen-Key设计。
标签： 反馈滤波器
上传时间： 2013-11-15
上传用户：robter
Differential Nonlinearity: Ideally, any two adjacent digitalcodes correspond to output analog voltages that are exactlyone LSB apart. Differential non-linearity is a measure of theworst case deviation from the ideal 1 LSB step. For example,a DAC with a 1.5 LSB output change for a 1 LSB digital codechange exhibits 1⁄2 LSB differential non-linearity. Differentialnon-linearity may be expressed in fractional bits or as a percentageof full scale. A differential non-linearity greater than1 LSB will lead to a non-monotonic transfer function in aDAC.Gain Error (Full Scale Error): The difference between theoutput voltage (or current) with full scale input code and theideal voltage (or current) that should exist with a full scale inputcode.Gain Temperature Coefficient (Full Scale TemperatureCoefficient): Change in gain error divided by change in temperature.Usually expressed in parts per million per degreeCelsius (ppm/°C).Integral Nonlinearity (Linearity Error): Worst case deviationfrom the line between the endpoints (zero and full scale).Can be expressed as a percentage of full scale or in fractionof an LSB.LSB (Lease-Significant Bit): In a binary coded system thisis the bit that carries the smallest value or weight. Its value isthe full scale voltage (or current) divided by 2n, where n is theresolution of the converter.Monotonicity: A monotonic function has a slope whose signdoes not change. A monotonic DAC has an output thatchanges in the same direction (or remains constant) for eachincrease in the input code. the converse is true for decreasing codes.
标签： Converters Defini DAC
上传时间： 2013-10-30
上传用户：stvnash
ANALOG INPUT BANDWIDTH is a measure of the frequencyat which the reconstructed output fundamental drops3 dB below its low frequency value for a full scale input. Thetest is performed with fIN equal to 100 kHz plus integer multiplesof fCLK. The input frequency at which the output is −3dB relative to the low frequency input signal is the full powerbandwidth.APERTURE JITTER is the variation in aperture delay fromsample to sample. Aperture jitter shows up as input noise.APERTURE DELAY See Sampling Delay.BOTTOM OFFSET is the difference between the input voltagethat just causes the output code to transition to the firstcode and the negative reference voltage. Bottom Offset isdefined as EOB = VZT–VRB, where VZT is the first code transitioninput voltage and VRB is the lower reference voltage.Note that this is different from the normal Zero Scale Error.CONVERSION LATENCY See PIPELINE DELAY.CONVERSION TIME is the time required for a completemeasurement by an analog-to-digital converter. Since theConversion Time does not include acquisition time, multiplexerset up time, or other elements of a complete conversioncycle, the conversion time may be less than theThroughput Time.DC COMMON-MODE ERROR is a specification which appliesto ADCs with differential inputs. It is the change in theoutput code that occurs when the analog voltages on the twoinputs are changed by an equal amount. It is usually expressed in LSBs.
上传时间： 2013-11-12
上传用户：pans0ul
•Founded in Jan. 08, 2001 in Shanghai, China.•Fabless IDH focused on Analog & Mixed Signal Chip design & marketing •Over 100 IC introduced.•Over 200 OEM Customer worldwide•ISO-9000 Certified•Distribution Channel in Taiwan, China & Japan To achieve 100% customer satisfactionby producing the technically advanced product with the best quality, on-time delivery and service. Leverages on proprietary process and world-class engineering team to develop innovative & high quality analog solutions that add value to electronics equipment.
标签： Circuit Analog Design Porta
上传时间： 2013-10-24
上传用户：songnanhua
Construction Strategy of ESD Protection CircuitAbstract： The principles used to construct ESD protection on circuits and the basic conceptions of ESD protection design are presented.Key words：ESD protection/On circuit, ESD design window, ESD current path1 引言静电放电（ESD，Electrostatic Discharge）给电子器件环境会带来破坏性的后果。它是造成集成电路失效的主要原因之一。随着集成电路工艺不断发展，互补金属氧化物半导体（CMOS，Complementary Metal-Oxide Semiconductor）的特征尺寸不断缩小，金属氧化物半导体(MOS, Metal-Oxide Semiconductor)的栅氧厚度越来越薄，MOS 管能承受的电流和电压也越来越小，因此要进一步优化电路的抗ESD 性能，需要从全芯片ESD 保护结构的设计来进行考虑。
标签： Construction Strategy ESD of
上传时间： 2013-11-09
上传用户：Aidane
TCS ECN Background & Key TermsTrust Issues with PCIe PlatformsTCS ECN DetailsTrusted Config Space and TCS TransactionsTrusted Config Access Mech (TCAM)Standard vs Trusted Config AccessNew Capability StructuresTCS Support in Root Ports, Switches, & BridgesTCS “Does not…” ListExample Trusted Computing PlatformRevisiting the Trust IssuesKey Takeaways/Call to ActionQuestions
标签： Configuration Trusted PCIe Spa
上传时间： 2013-11-21
上传用户：hsfei8
【摘要】本文结合作者多年的印制板设计经验，着重印制板的电气性能，从印制板稳定性、可靠性方面，来讨论多层印制板设计的基本要求。【关键词】印制电路板；表面贴装器件；高密度互连；通孔【Key words】Printed Circuit Board；Surface Mounting Device；High Density Interface；Via一．概述印制板（PCB－Printed Circuit Board）也叫印制电路板、印刷电路板。多层印制板，就是指两层以上的印制板，它是由几层绝缘基板上的连接导线和装配焊接电子元件用的焊盘组成，既具有导通各层线路，又具有相互间绝缘的作用。随着SMT（表面安装技术）的不断发展，以及新一代SMD（表面安装器件）的不断推出，如QFP、QFN、CSP、BGA（特别是MBGA），使电子产品更加智能化、小型化，因而推动了PCB工业技术的重大改革和进步。自1991年IBM公司首先成功开发出高密度多层板（SLC）以来，各国各大集团也相继开发出各种各样的高密度互连（HDI）微孔板。这些加工技术的迅猛发展，促使了PCB的设计已逐渐向多层、高密度布线的方向发展。多层印制板以其设计灵活、稳定可靠的电气性能和优越的经济性能，现已广泛应用于电子产品的生产制造中。下面，作者以多年设计印制板的经验，着重印制板的电气性能，结合工艺要求，从印制板稳定性、可靠性方面，来谈谈多层制板设计的基本要领。
上传时间： 2013-11-19
上传用户：zczc
