Solving Integration and differential equations
标签： differential Integration equations Solving
上传时间： 2013-12-28
上传用户：zhuimenghuadie
第一部分 信号完整性知识基础.................................................................................5第一章 高速数字电路概述.....................................................................................51.1 何为高速电路...............................................................................................51.2 高速带来的问题及设计流程剖析...............................................................61.3 相关的一些基本概念...................................................................................8第二章 传输线理论...............................................................................................122.1 分布式系统和集总电路.............................................................................122.2 传输线的RLCG 模型和电报方程...............................................................132.3 传输线的特征阻抗.....................................................................................142.3.1 特性阻抗的本质.................................................................................142.3.2 特征阻抗相关计算.............................................................................152.3.3 特性阻抗对信号完整性的影响.........................................................172.4 传输线电报方程及推导.............................................................................182.5 趋肤效应和集束效应.................................................................................232.6 信号的反射.................................................................................................252.6.1 反射机理和电报方程.........................................................................252.6.2 反射导致信号的失真问题.................................................................302.6.2.1 过冲和下冲.....................................................................................302.6.2.2 振荡：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分线的匹配.................................................................................392.6.3.4 多负载的匹配.................................................................................41第三章 串扰的分析...............................................................................................423.1 串扰的基本概念.........................................................................................423.2 前向串扰和后向串扰.................................................................................433.3 后向串扰的反射.........................................................................................463.4 后向串扰的饱和.........................................................................................463.5 共模和差模电流对串扰的影响.................................................................483.6 连接器的串扰问题.....................................................................................513.7 串扰的具体计算.........................................................................................543.8 避免串扰的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的产生..................................................................................................614.2.1 电压瞬变.............................................................................................614.2.2 信号的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 电场屏蔽.........................................................................................654.3.1.2 磁场屏蔽.........................................................................................674.3.1.3 电磁场屏蔽.....................................................................................674.3.1.4 电磁屏蔽体和屏蔽效率.................................................................684.3.2 滤波.....................................................................................................714.3.2.1 去耦电容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 设计中的EMI.......................................................................................754.4.1 传输线RLC 参数和EMI ........................................................................764.4.2 叠层设计抑制EMI ..............................................................................774.4.3 电容和接地过孔对回流的作用.........................................................784.4.4 布局和走线规则.................................................................................79第五章 电源完整性理论基础...............................................................................825.1 电源噪声的起因及危害.............................................................................825.2 电源阻抗设计.............................................................................................855.3 同步开关噪声分析.....................................................................................875.3.1 芯片内部开关噪声.............................................................................885.3.2 芯片外部开关噪声.............................................................................895.3.3 等效电感衡量SSN ..............................................................................905.4 旁路电容的特性和应用.............................................................................925.4.1 电容的频率特性.................................................................................935.4.3 电容的介质和封装影响.....................................................................955.4.3 电容并联特性及反谐振.....................................................................955.4.4 如何选择电容.....................................................................................975.4.5 电容的摆放及Layout ........................................................................99第六章 系统时序.................................................................................................1006.1 普通时序系统...........................................................................................1006.1.1 时序参数的确定...............................................................................1016.1.2 时序约束条件...................................................................................1063.2 高速设计的问题.......................................................................................2093.3 SPECCTRAQuest SI Expert 的组件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系统......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自动布线器.......................................................2303.4 高速设计的大致流程...............................................................................2303.4.1 拓扑结构的探索...............................................................................2313.4.2 空间解决方案的探索.......................................................................2313.4.3 使用拓扑模板驱动设计...................................................................2313.4.4 时序驱动布局...................................................................................2323.4.5 以约束条件驱动设计.......................................................................2323.4.6 设计后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的进阶运用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 图形化的拓扑结构探索...........................................................................2344.3 全面的信号完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 设计前和设计的拓扑结构提取.......................................................2354.6 仿真设置顾问...........................................................................................2354.7 改变设计的管理.......................................................................................2354.8 关键技术特点...........................................................................................2364.8.1 拓扑结构探索...................................................................................2364.8.2 SigWave 波形显示器........................................................................2364.8.3 集成化的在线分析(Integration and In-process Analysis) .236第五章 部分特殊的运用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信号的仿真.......................................................................................2435.3 眼图模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 进行前仿真.......................................................................2511.1 用LineSim 进行仿真工作的基本方法...................................................2511.2 处理信号完整性原理图的具体问题.......................................................2591.3 在LineSim 中如何对传输线进行设置...................................................2601.4 在LineSim 中模拟IC 元件.....................................................................2631.5 在LineSim 中进行串扰仿真...................................................................268第二章 使用BOARDSIM 进行后仿真......................................................................2732.1 用BOARDSIM 进行后仿真工作的基本方法...................................................2732.2 BoardSim 的进一步介绍..........................................................................2922.3 BoardSim 中的串扰仿真..........................................................................309
上传时间： 2014-04-18
上传用户：wpt
The LTP5900 includes sufficient power supply filtering and decoupling capacitancesuch that additional filtering should not be necessary for most battery-powereddesigns. Care must be taken to avoid large transient voltages on the supply as theM2510 steps up its current consumption (see the section on Supply Design below).
标签： Integration Hardware Guide 5900
上传时间： 2014-12-24
上传用户：youmo81
The LTP5901 and LTP5902 require little external circuitry, as the devices references,decoupling and power supply filtering are integrated. The LTP5901 and LTP5902 will bemodularly certified for operation in the United States (FCC), Canada (IC) and theEuropean Union (CE).
标签： Integration LTP Hardware Guide
上传时间： 2013-11-22
上传用户：sunchao524
Linear Technology offers a variety of devices that simplifyconverting power from a USB cable, but the LTC®3455represents the highest level of functional Integration yet. The LTC3455 seamlessly manages power flowbetween an AC adapter, USB cable and Li-ion battery,while complying with USB power standards, all from a4mm × 4mm QFN package. In addtion, two high efficiencysynchronous buck converters generate low voltage railswhich most USB-powered peripherals require. TheLTC3455 also provides power-on reset signals for themicroprocessor, a Hot SwapTM output for poweringmemory cards as well as an uncommitted gain blocksuitable for use as a low-battery comparator or an LDOcontroller. The PCB real estate required for the entire USBpower control circuit and two DC/DC converters is only225mm2.
上传时间： 2013-11-02
上传用户：名爵少年
Advancements in board assembly, PCB layout anddigital IC Integration have produced a new generationof densely populated, high performance systems. Theboard-mounted point-of-load (POL) DC/DC power suppliesin these systems are subject to the same demandingsize, high power and performance requirements asother subsystems. The rigorous new POL demands aredifficult to meet with traditional controller or regulatorICs, or power modules.
上传时间： 2014-12-24
上传用户：lbbyxmraon
Abstract: This article discusses future trends in the design of smartphones and other consumer products. The discussion focuses onthe importance of Integration, which saves valuable PCB space and drives down costs.
上传时间： 2014-01-13
上传用户：lhw888
The LTM8020, LTM8021, LTM8022 and LTM8023 μModule®regulators are complete easy-to-use encapsulated stepdownDC/DC regulators intended to take the pain and aggravationout of implementing a switching power supplyonto a system board. With a μModule regulator, you onlyneed an input cap, output cap and one or two resistorsto complete the design. As one might imagine, this highlevel of Integration greatly simplifi es the task of printedcircuit board design, reducing the effort to four categories:component footprint generation, component placement,routing the nets, and thermal vias.
上传时间： 2014-01-18
上传用户：laomv123
为提高温度测量效率，降低系统的成本，扩展传输距离，设计出一种新型温度采集系统。单片机通过控制具有单总线方式的温度传感器DS18B20实现对温度的测量，同时单片机通过控制具有单总线方式300～450MHz频率范围内的MAX7044与MAX7033无线发射与接收芯片实现温度数据的无线传输。与传统温度采集系统相比，该系统利用单总线方式连接，采用无线传输方式实现远距离通信，易于系统的集成与扩展。实验结果表明，该系统结构简单、方便移植，能够同时实现多达上百点温度的测量与500m范围的传输。 Abstract: To improve the temperature measurement efficiency and reduce system cost,expansion of transmission distance,a new type of temperature acquisition system is designed.Microcontroller controlled temperature sensor DS18B20which has a single-bus achieves temperature measurement,while microcontroller by controlled the MAX7044and MAX7033chip with a single-bus and having300~450MHz radiofrequency to achieve the wireless transmission of temperature data.Compared with conventional temperature acquisition system,the system uses single-bus connected,and uses wireless transmission means to achieve long-distance communications,easy-to-system Integration and expansion.The experimental results show that the system is simple,convenient transplantation,and can be implemented in as many as a hundred-point temperature measure-ment and the transmission range of500meters.
上传时间： 2013-10-29
上传用户：515414293
为了在工业生产及过程控制中准确测量温度，设计了一种基于低功耗MSP430单片机的数字温度计。整个系统通过单片机MSP430F1121A控制DS18B20读取温度，采用数码管显示，温度传感器DS18B20与单片机之间通过串口进行数据传输。MSP430系列单片机具有超低功耗，且外围的整合性高，DS18B20只需一个端口即可实现数据通信，连接方便。通过多次实验证明，该系统的测试结果与实际环境温度一致，除了具有接口电路简单、测量精度高、误差小、可靠性高等特点外，其低成本、低功耗的特点使其拥有更广阔的应用前景。 Abstract: In order to obtain accurate measuring temperature in industrial production and process control， a digital thermometer based on MSP430 MCU is designed. The system uses MSP430F1121A MCU to control DS18B20， and gets the temperature data， which is displayed on the LED. The temperature sensor DS18B20 and MCU transmit data through serial communication. MSP430 series has ultra-low power and high Integration， DS18B20 only needs one port to achieve data communication. Through many experimental results prove， this system is consistent with actual environment temperature. The system has characteristics of interface circuit simple， high measuring accuracy， minor error， high reliability， besides， the characteristics of low cost and low power make it having vaster application prospect.
上传时间： 2013-10-16
上传用户：wettetw
