Abstract: There are many things to consider when designing a power supply for a field-programmablegate array (FPGA). These include (but are not limited to) the HIGH number of voltage rails, and thediffering requirements for both sequencing/tracking and the voltage ripple limits. This application noteexplains these and other power-supply considerations that an engineer must think through whendesigning a power supply for an FPGA.
上传时间： 2013-11-10
上传用户：iswlkje
HDB3(HIGH Density Bipolar三阶高密度双极性)码是在AMI码的基础上改进的一种双极性归零码，它除具有AMI码功率谱中无直流分量，可进行差错自检等优点外，还克服了AMI码当信息中出现连“0”码时定时提取困难的缺点，而且HDB3码频谱能量主要集中在基波频率以下，占用频带较窄，是ITU-TG.703推荐的PCM基群、二次群和三次群的数字传输接口码型,因此HDB3码的编解码就显得极为重要了[1]。目前，HDB3码主要由专用集成电路及相应匹配的外围中小规模集成芯片来实现，但集成程度不高，特别是位同步提取非常复杂，不易实现。随着可编程器件的发展，这一难题得到了很好地解决。
上传时间： 2013-11-21
上传用户：sy_jiadeyi
Abstract: Designers who must interface 1-Wire temperature sensors with Xilinx field-programmable gate arrays(FPGAs) can use this reference design to drive a DS28EA00 1-Wire slave device. The downloadable softwarementioned in this document can also be used as a starting point to connect other 1-Wire slave devices. The systemimplements a 1-Wire master connected to a UART and outputs temperature to a PC from the DS28EA00 temperaturesensor. In addition, HIGH/low alarm outputs are displayed from the DS28EA00 PIO pins using LEDs.
标签： PicoBlaze Create Master Xilinx
上传时间： 2013-11-05
上传用户：a6697238
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address HIGH pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
This application note describes how to implement the Bus LVDS (BLVDS) interface in the supported Altera ® device families for HIGH-performance multipoint applications. This application note also shows the performance analysis of a multipoint application with the Cyclone III BLVDS example.
标签： Implementing LVDS 522 Bus
上传时间： 2013-11-10
上传用户：frank1234
Designing withProgrammable Logicin an Analog WorldProgrammable logic devicesrevolutionized digital design over 25years ago, promising designers a blankchip to design literally any functionand program it in the field. PLDs canbe low-logic density devices that usenonvolatile sea-of-gates cells calledcomplex programmable logic devices(CPLDs) or they can be HIGH-densitydevices based on SRAM look-up tables
标签： Solutions Analog Xilinx FPGAs
上传时间： 2013-11-01
上传用户：a67818601
Designing withProgrammable Logicin an Analog WorldProgrammable logic devices revolutionizeddigital design over 25 years ago,promising designers a blank chip todesign literally any function and programit in the field. PLDs can be low-logicdensity devices that use nonvolatilesea-of-gates cells called complexprogrammable logic devices (CPLDs)or they can be HIGH-density devicesbased on SRAM look-up tables (LUTs)
标签： Solutions Analog Altera FPGAs
上传时间： 2013-11-08
上传用户：虫虫虫虫虫虫
Consumer display applications commonly use HIGH-speed LVDS interfaces to transfer videodata. Spread-spectrum clocking can be used to address electromagnetic compatibility (EMC)issues within these consumer devices. This application note uses Spartan®-6 FPGAs togenerate spread-spectrum clocks using the DCM_CLKGEN primitive.
上传时间： 2014-12-28
上传用户：yan2267246
The SDI standards are the predominant standards for uncompressed digital videointerfaces in the broadcast studio and video production center. The first SDI standard,SD-SDI, allowed standard-definition digital video to be transported over the coaxial cableinfrastructure initially installed in studios to carry analog video. Next, HD-SDI wasto support HIGH-definition video. Finally, dual link HD-SDI and 3G-SDIdoubled the bandwidth of HD-SDI to support 1080p (50 Hz and 60 Hz) and other videoformats requiring more bandwidth than HD-SDI provides.
上传时间： 2013-10-08
上传用户：yjj631
Xilinx Next Generation 28 nm FPGA Technology Overview Xilinx has chosen 28 nm HIGH-κ metal gate (HKMG) HIGHperformance,low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and HIGHer performance. These devices enable unprecedented levels of integration and bandwidth and provide system architects and designers a fully programmable alternative to ASSPs and ASICs.
上传时间： 2014-12-28
上传用户：zhang97080564
