SFP模块的国际标准. Cooperation Agreement for Small Form-Factor Pluggable Transceivers
标签： Transceivers Cooperation Form-Factor Agreement
上传时间： 2015-09-05
上传用户：h886166
CP-1000 是 Antec 新的高阶电源供应器.结合全新的技术,CP-1000 提供了绝佳的性价比. 新的功能有: 革新的电路设计; 较大的空间可以安排电子零件及增进风流; 直流式的风道设计,让风扇的风可以直接吹进机身内部. 使用较大的风扇在低转速时就可以提供很好的风流效果,而且还不会制造噪音. Antec 新的 form factor: CPX, 他比其他标准大小也使用大风扇的 PSU 可以提供更好的风流效果. CP-1000 可以安装在 Antec 的Performance One 和 Gaming 机箱上,包含 Twelve Hundred, P183 和 P193.
上传时间： 2013-10-17
上传用户：lijianyu172
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
Abstract: The reality of modern, small Form-Factor ceramic capacitors is a good reminder to always readthe data sheet. This tutorial explains how ceramic capacitor type designations, such as X7R and Y5V,imply nothing about voltage coefficients. Engineers must check the data to know, really know, how aspecific capacitor will perform under voltage.
上传时间： 2013-11-04
上传用户：梧桐
A major societal challenge for the decades to come will be the delivery of effective medical services while at the same time curbing the growing cost of healthcare. It is expected that new concepts-particularly electronically assisted healthcare will provide an answer. This will include new devices, new medical services as well as networking. On the device side, impressive innovation has been made possible by micro- and nanoelectronics or CMOS Integrated Circuits. Even higher accuracy and smaller form factor combined with reduced cost and increased convenience of use are enabled by incorporation of CMOS IC design in the realization of biomedical systems. The compact hearing aid devices and current pacemakers are good examples of how CMOS ICs bring about these new functionalities and services in the medical field. Apart from these existing applications, many researchers are trying to develop new bio-medical solutions such as Artificial Retina, Deep Brain Stimulation, and Wearable Healthcare Systems. These are possible by combining the recent advances of bio-medical technology with low power CMOS IC technology.
上传时间： 2017-02-06
上传用户：linyj
The SA7527 is an active power factor correction(PFC)controller for boost PFC application whic
标签： Correction Circuit Design Factor
上传时间： 2013-04-24
上传用户：onewq
struts in action, 详细介绍action,form的使用方法。经典
上传时间： 2013-12-22
上传用户：hustfanenze
如何使用图形对象（如Form，Image等）的画布（Canvas）在C++Builder应用程序中绘制图形
上传时间： 2013-12-18
上传用户：zgu489
改变Form的标题
上传时间： 2013-12-11
上传用户：kristycreasy
