热仿真软件FLOTHERM V9.3破解文件
标签： 热仿真技术破解文件
上传时间： 2015-05-30
上传用户：zlhdkbb
以上是FLOTHERM软件的核心操作，以及热设计原理介绍，困难点方案处理
上传时间： 2021-10-17
上传用户：tigerwxf1
最全的热设计基础知识及FLOTHERM热仿真，很有用的资料，请收藏。
上传时间： 2022-03-26
上传用户：fliang
热仿真软件教程，对于器件、电子电路的热分析软件，该软件占有全球80%的客户
上传时间： 2013-04-24
上传用户：y307115118
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware FLOTHERM, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上传时间： 2013-11-10
上传用户：1595690
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware FLOTHERM, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上传时间： 2013-11-16
上传用户：萍水相逢
本文是我从事10年电子设备散热和仿真设计工作积累总结的核心经验知识，7天即可全面掌握热设计知识+软件仿真计算，满满的干货，今天拿出来和大家分享，电子电路设计和热设计不分家，本文帮助电子设计工程师迅速掌握热设计。总共有3大部分内容：第1部分：7天全面掌握电子设备散热设计，让你迅速掌握散热基础知识，并辅助公式计算和定性分析；第2部分：专业热仿真软件FLOTHERM_经典教程，手把手教你散热仿真，和第1部分穿插同时学习，5天即可掌握；第3部分：FLOTHERM9.3热仿真软件安装包和安装教程，从链接的百度微盘下载。第一部分 7天全面掌握电子设备散热设计1 散热设计基础2 自然冷却设计原理及计算3 强迫风冷设计原理及计算4 电子设备散热设计流程综述5 集成电源散热设计6 模块电源设计7 集成开关电源设计第2部分1 FLOTHERM 基本操作2 建立、求解、分析-简单的电子设备机箱3 细化印刷电路板优化模型4 软件直接添加电源模块 5 网格设置和优化求解域 6 添加散热器和风扇设置 7 响应面和优化8 使用 FLOTHERM.PACK 生成热模型
标签： 热设计
上传时间： 2022-05-13
上传用户：kingwide
