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ESD-protected

  • ESD+Basics

    This text, ESD Basics: From Semiconductor Manufacturing to Product Use was initiated on the need to produce a text that addresses fundamentals of electrostatic discharge from the manufacturing environment to today’s products. As the manufacturing world evolves, semi- conductor networks scale, and systems are changing, the needs and requirements for reliabi- lity and ESD protection are changing. A text is required that connects basic ESD phenomena to today’s real world environment.

    标签: Basics ESD

    上传时间: 2020-06-05

    上传用户:shancjb

  • ESD+Circuits+and+Devices

    In the field of electricity, electrostatics, and circuit theory, there are many discoveries and accomplishments that have lead to the foundation of the field of electrostatic discharge (ESD) phenomenon. Below is a chronological list of key events that moved the field of electrostatics forward:

    标签: Circuits Devices ESD and

    上传时间: 2020-06-05

    上传用户:shancjb

  • Basic ESD Design Guidelines

    ESD is a crucial factor for integrated circuits and influences their quality and reliability. Today increasingly sensitive processes with deep sub micron structures are developed. The integration of more and more functionality on a single chip and saving of chip area is required. Integrated circuits become more susceptible to ESD/EOS related damages. However, the requirements on ESD robustness especially for automotive applications are increasing. ESD failures are very often the reason for redesigns. Much research has been conducted by semiconductor manufacturers on ESD robust design.

    标签: Guidelines Design Basic ESD

    上传时间: 2020-06-05

    上传用户:shancjb

  • ESD-Phenomena-and-the-Reliability

    As we enter the next millennium, there are clear technological patterns. First, the electronic industry continues to scale microelectronic structures to achieve faster devices, new devices, or more per unit area. Secondly, electrostatic charge, electrostatic discharge (ESD), electrical overstress (EOS) and electromagnetic emissions (EMI) continue to be a threat to these scaled structures. This dichotomy presents a dilemma for the scaling of semiconductor technologies and a future threat to new technologies. Technological advancements, material changes, design techniques, and simulation can fend off this growing concern – but to maintain this ever-threatening challenge, one must continue to establish research and education in this issue. 

    标签: ESD-Phenomena-and-the-Reliability

    上传时间: 2020-06-05

    上传用户:shancjb

  • 常用PCB LOGO 标识3C ISO9001 EMMC静电ESD ROHS 国家免检 质量安全 二

    常用PCB LOGO 标识3C ISO9001 EMMC静电ESD ROHS 国家免检 质量安全 二维码标识(AD库),PcbLib后缀文件,可以直接应用到你的项目开发。封装库列表:Component Count : 39Component Name-----------------------------------------------AAACCCCECHUANGXINCQCEMCENECESDESD2FCICO1ISO 14001ISO9001ISO9001-1ISO9002LOGO_ThunderPBPCBComponent_1 - duplicate2PCBComponent_1 - duplicate3PCBComponent_1 - duplicate4PESPETQECRoHsRoHS-1SATUVTUV-1ULUL-1USB_LOGOVDE店铺二维码-大国家免检垃圾桶图案微信二维码-大质量安全中国环保

    标签: pcb esd

    上传时间: 2021-12-22

    上传用户:

  • 静电放电ESD保护器件的模拟与仿真

    静电放电(Electrostatic Discharge,ESD)是构成集成电路可靠性的主要因素之一,存在于生产到使用的每一个环节,并成为开发新一代工艺技术的难点之一,近年来,对ESD的研究也因而越来越受到重视,仿真工具在ESD领域的应用使得ESD防护的研究变得更为便利,可大幅缩短研发周期然而,由于ESD现象复杂的物理机制,极端的电场及温度条件,以及ESD仿真中频繁的不收敛现象,都使得FSD的仿真变得极为困难本文详细阐述了ESD的来源、造成的危害以及如何测试集成电路的防静电冲击能力,并基于 Sentaurus软件,对ESD防护器件展开了的分析、研究,内容包括1)掌握ESD保护的基本理论、测试方法和防护机理2)研究了工艺仿真流程的步骤以及网格定义在工艺仿真中的重要性,并对网格定义的方法进行了探讨3)硏究了器件仿真流程以及器件仿真中的物理模型和模型函数,并对描述同一物理机制的的各种不同模型展开对比分析.主要包括传输方程模型、能帶模型、各种迁移率退化模型、雪崩离化模型和复合模型4)研究了双极型晶体管和可控硅(Silicon Controlled rectifier,SCR)防护器件的仿真,并通过对仿真结果的分析,研究了ESD保护器件在ESD应力作用下的工作机理关键词:静电放电;网格;器件仿真;双极型晶体管;可控硅

    标签: 静电放电 esd

    上传时间: 2022-03-30

    上传用户:

  • 华为ESD控制规范,ESD设计规范文件,内部新员工培训资料

    ESD设计很好的参考技术资料,从原来到具体的制版都有详细的介绍。

    标签: ESD

    上传时间: 2022-04-08

    上传用户:默默

  • IEC 61000-4-2 2001版本,ESD静电测试标准

    本文档为ESD测试相关的国际标准,IEC 61000-4-2 2001版本,包括空气放电和接触放电,内容涵盖测试方法,实验台的设置,以及相关模型参数的配置,如150 pF/330 Ω 和 330 pF/330 Ω 两种放电模块。

    标签: ESD

    上传时间: 2022-06-21

    上传用户:

  • PCB以及ESD设计准则

    PCB以及ESD设计准则                     

    标签: pcb esd设计

    上传时间: 2022-07-16

    上传用户:1208020161

  • VITA46-48-42 技术资料

    VITA 46 Highlights Retain standard 6U and 3U form-factors Height, depth, pitch, front panel arrangements, conduction-cooled interfaces, etc.Support standard-length PMC and XMC modules· Support high-speed serial fabric on the backplane Tyco MultiGig RT2,7-row connector· Support VME and PCI interfaces for legacy compatibility· Provision for optical connectors as option· Support improved logistics Provide support for Line Replaceable Module(LRM) applications with ESD-protected connector Alignment and keying blocks

    标签: vita46

    上传时间: 2022-07-25

    上传用户: