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  • DN492-双单片降压集成温度监控模块

      Multioutput monolithic regulators are easy to use and fi tinto spaces where multichip solutions cannot. Nevertheless,the popularity of multioutput regulators is temperedby a lack of options for input voltages above 30V andsupport of high output currents. The LT3692A fi lls thisgap with a dual monolithic regulator that operates frominputs up to 36V. It also includes a number of channeloptimization features that allow the LT3692A’s per-channelperformance to rival that of multichip solutions.

    标签: 492 DN 降压 温度监控

    上传时间: 2014-01-03

    上传用户:Huge_Brother

  • RT9005/RT9005A/RT9005B datasheet pdf

    The RT9005A/B is a dual-output Linear regulator for DDR-SDRAM VDDQ supply and termination voltage VTT supply.

    标签: 9005 datasheet RT

    上传时间: 2013-11-13

    上传用户:lmq0059

  • MAX338/MAX339的英文数据手册

      本软件是关于MAX338, MAX339的英文数据手册:MAX338, MAX339   8通道/双4通道、低泄漏、CMOS模拟多路复用器   The MAX338/MAX339 are monolithic, CMOS analog multiplexers (muxes). The 8-channel MAX338 is designed to connect one of eight inputs to a common output by control of a 3-bit binary address. The dual, 4-channel MAX339 is designed to connect one of four inputs to a common output by control of a 2-bit binary address. Both devices can be used as either a mux or a demux. On-resistance is 400Ω max, and the devices conduct current equally well in both directions.   These muxes feature extremely low off leakages (less than 20pA at +25°C), and extremely low on-channel leakages (less than 50pA at +25°C). The new design offers guaranteed low charge injection (1.5pC typ) and electrostatic discharge (ESD) protection greater than 2000V, per method 3015.7. These improved muxes are pin-compatible upgrades for the industry-standard DG508A and DG509A. For similar Maxim devices with lower leakage and charge injection but higher on-resistance, see the MAX328 and MAX329.

    标签: MAX 338 339 英文

    上传时间: 2013-11-12

    上传用户:18711024007

  • 使用Nios II紧耦合存储器教程

                 使用Nios II紧耦合存储器教程 Chapter 1. Using Tightly Coupled Memory with the Nios II Processor Reasons for Using Tightly Coupled Memory  . . . . . . . . . . . . . . . . . . . . . . . 1–1 Tradeoffs  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1 Guidelines for Using Tightly Coupled Memory . . . .. . . . . . . . 1–2 Hardware Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 Software Guidelines  . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . 1–3 Locating Functions in Tightly Coupled Memory  . . . . . . . . . . . . . 1–3 Tightly Coupled Memory Interface   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4 Restrictions   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4 Dual Port Memories  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . 1–5 Building a Nios II System with Tightly Coupled Memory  . . . . . . . . . . . 1–5

    标签: Nios 耦合 存储器 教程

    上传时间: 2013-10-13

    上传用户:黄婷婷思密达

  • XAPP228 -Virtex器件内的四端口存储器

    This application note describes how the existing dual-port block memories in the Spartan™-IIand Virtex™ families can be used as Quad-Port memories. This essentially involves a dataaccess time (halved) versus functionality (doubled) trade-off. The overall bandwidth of the blockmemory in terms of bits per second will remain the same.

    标签: Virtex XAPP 228 器件

    上传时间: 2014-01-24

    上传用户:15527161163

  • WP247 - Virtex-5系列高级封装

    The exacting technological demands created byincreasing bandwidth requirements have given riseto significant advances in FPGA technology thatenable engineers to successfully incorporate highspeedI/O interfaces in their designs. One aspect ofdesign that plays an increasingly important role isthat of the FPGA package. As the interfaces get fasterand wider, choosing the right package has becomeone of the key considerations for the systemdesigner.

    标签: Virtex 247 WP 高级封装

    上传时间: 2013-11-07

    上传用户:wanghui2438

  • WP328-FPGA的语音数据融合

      The SDI standards are the predominant standards for uncompressed digital videointerfaces in the broadcast studio and video production center. The first SDI standard,SD-SDI, allowed standard-definition digital video to be transported over the coaxial cableinfrastructure initially installed in studios to carry analog video. Next, HD-SDI wasto support high-definition video. Finally, dual link HD-SDI and 3G-SDIdoubled the bandwidth of HD-SDI to support 1080p (50 Hz and 60 Hz) and other videoformats requiring more bandwidth than HD-SDI provides.

    标签: FPGA 328 WP 语音

    上传时间: 2013-12-08

    上传用户:liansi

  • WP369可扩展式处理平台-各种嵌入式系统的理想解决方案

    WP369可扩展式处理平台-各种嵌入式系统的理想解决方案 :Delivering unrivaled levels of system performance,flexibility, scalability, and integration to developers,Xilinx's architecture for a new Extensible Processing Platform is optimized for system power, cost, and size. Based on ARM's dual-core Cortex™-A9 MPCore processors and Xilinx’s 28 nm programmable logic,the Extensible Processing Platform takes a processor-centric approach by defining a comprehensive processor system implemented with standard design methods. This approach provides Software Developers a familiar programming environment within an optimized, full featured,powerful, yet low-cost, low-power processing platform.

    标签: 369 WP 扩展式 处理平台

    上传时间: 2013-10-18

    上传用户:cursor

  • IC封裝製程簡介(IC封装制程简介)

    半導體的產品很多,應用的場合非常廣泛,圖一是常見的幾種半導體元件外型。半導體元件一般是以接腳形式或外型來劃分類別,圖一中不同類別的英文縮寫名稱原文為   PDID:Plastic Dual Inline Package SOP:Small Outline Package SOJ:Small Outline J-Lead Package PLCC:Plastic Leaded Chip Carrier QFP:Quad Flat Package PGA:Pin Grid Array BGA:Ball Grid Array         雖然半導體元件的外型種類很多,在電路板上常用的組裝方式有二種,一種是插入電路板的銲孔或腳座,如PDIP、PGA,另一種是貼附在電路板表面的銲墊上,如SOP、SOJ、PLCC、QFP、BGA。    從半導體元件的外觀,只看到從包覆的膠體或陶瓷中伸出的接腳,而半導體元件真正的的核心,是包覆在膠體或陶瓷內一片非常小的晶片,透過伸出的接腳與外部做資訊傳輸。圖二是一片EPROM元件,從上方的玻璃窗可看到內部的晶片,圖三是以顯微鏡將內部的晶片放大,可以看到晶片以多條銲線連接四周的接腳,這些接腳向外延伸並穿出膠體,成為晶片與外界通訊的道路。請注意圖三中有一條銲線從中斷裂,那是使用不當引發過電流而燒毀,致使晶片失去功能,這也是一般晶片遭到損毀而失效的原因之一。   圖四是常見的LED,也就是發光二極體,其內部也是一顆晶片,圖五是以顯微鏡正視LED的頂端,可從透明的膠體中隱約的看到一片方型的晶片及一條金色的銲線,若以LED二支接腳的極性來做分別,晶片是貼附在負極的腳上,經由銲線連接正極的腳。當LED通過正向電流時,晶片會發光而使LED發亮,如圖六所示。     半導體元件的製作分成兩段的製造程序,前一段是先製造元件的核心─晶片,稱為晶圓製造;後一段是將晶中片加以封裝成最後產品,稱為IC封裝製程,又可細分成晶圓切割、黏晶、銲線、封膠、印字、剪切成型等加工步驟,在本章節中將簡介這兩段的製造程序。

    标签: 封裝 IC封装 制程

    上传时间: 2013-11-04

    上传用户:372825274

  • In most software-development organizations, the testing program functions as the final "quality gat

    In most software-development organizations, the testing program functions as the final "quality gate" for an application, allowing or preventing the move from the comfort of the software-engineering environment into the real world. With this role comes a large responsibility: The success of an application, and possibly of theorganization, can rest on the quality of the software product.

    标签: software-development organizations functions the

    上传时间: 2015-05-03

    上传用户:s363994250