Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections BETWEEN the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
This application note shows how a Xilinx CoolRunnerTM-II CPLD can be used as a simplelogical switch that can quickly and reliably select BETWEEN different MPEG video sources. Thesource code for the design is available on the Xilinx website, and is linked from the “VHDLCode” section. The code can be expanded by the user to perform additional operations usingthe remaining CPLD resources
标签： CoolRunner-II Xilinx XAPP CPLD
上传时间： 2013-12-16
上传用户：qwer0574
XAPP520将符合2.5V和3.3V I/O标准的7系列FPGA高性能I/O Bank进行连接 The I/Os in Xilinx® 7 series FPGAs are classified as either high range (HR) or high performance (HP) banks. HR I/O banks can be operated from 1.2V to 3.3V, whereas HP I/O banks are optimized for operation BETWEEN 1.2V and 1.8V. In circumstances that require an HP 1.8V I/O bank to interface with 2.5V or 3.3V logic, a range of options can be deployed. This application note describes methodologies for interfacing 7 series HP I/O banks with 2.5V and 3.3V systems
上传时间： 2013-11-06
上传用户：wentianyou
Calculation of the Differential Impedance of Tracks on FR4 substrates There is a discrepancy BETWEEN calculated and measured values of impedance for differential transmission lineson FR4. This is especially noticeable in the case of surface microstrip configurations. The anomaly is shown tobe due to the nature of the substrate material. This needs to be considered as a layered structure of epoxy resinand glass fibre. Calculations, using Boundary Element field methods, show that the distribution of the electricfield within this layered structure determines the apparent dielectric constant and therefore affects theimpedance. Thus FR4 cannot be considered to be uniform dielectric when calculating differential impedance.
上传时间： 2013-10-18
上传用户：masochism
解压密码：www.elecfans.com 随着微电子技术的迅速发展以及集成电路规模不断提高，对电路性能的设计 要求越来越严格，这势必对用于大规模集成电路设计的EDA 工具提出越来越高的 要求。自1972 年美国加利福尼亚大学柏克莱分校电机工程和计算机科学系开发 的用于集成电路性能分析的电路模拟程序SPICE（Simulation Program with IC Emphasis）诞生以来，为适应现代微电子工业的发展，各种用于集成电路设计的 电路模拟分析工具不断涌现。HSPICE 是Meta-Software 公司为集成电路设计中 的稳态分析，瞬态分析和频域分析等电路性能的模拟分析而开发的一个商业化通 用电路模拟程序，它在柏克莱的SPICE（1972 年推出），MicroSim公司的PSPICE （1984 年推出）以及其它电路分析软件的基础上，又加入了一些新的功能，经 过不断的改进，目前已被许多公司、大学和研究开发机构广泛应用。HSPICE 可 与许多主要的EDA 设计工具，诸如Candence,Workview 等兼容，能提供许多重要 的针对集成电路性能的电路仿真和设计结果。采用HSPICE 软件可以在直流到高 于100MHz 的微波频率范围内对电路作精确的仿真、分析和优化。在实际应用中， HSPICE能提供关键性的电路模拟和设计方案，并且应用HSPICE进行电路模拟时， 其电路规模仅取决于用户计算机的实际存储器容量。 The HSPICE Integrator Program enables qualified EDA vendors to integrate their products with the de facto standard HSPICE simulator, HSPICE RF simulator, and WaveView Analyzer™. In addition, qualified HSPICE Integrator Program members have access to HSPICE integrator application programming interfaces (APIs). Collaboration BETWEEN HSPICE Integrator Program members will enable customers to achieve more thorough design verification in a shorter period of time from the improvements offered by inter-company EDA design solutions.
上传时间： 2013-10-18
上传用户：s363994250
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects BETWEEN PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects BETWEEN a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上传时间： 2014-01-24
上传用户：s363994250
Abstract: How can an interface change a happy face to a sad face? Engineers have happy faces when an interface works properly.Sad faces indicate failure somewhere. Because interfaces BETWEEN microprocessors and ICs are simple—even easy—they are oftenignored until interface failure causes sad faces all around. In this article, we discuss a common SPI error that can be almostimpossible to find in a large system. Links to interface tutorial information are provided for complete information. Noise as a systemissue and ICs to minimize its effects are also described.
上传时间： 2013-11-18
上传用户：zgz317
A collection of interface applications BETWEEN various microprocessors/ controllers and the LTC1090 family of data acquisition systems. The note is divided into sections specific to each interface.
上传时间： 2013-11-08
上传用户：sssnaxie
利用EZ-USB接口芯片AN2131Q实现了基于TMS320C5409的水声信号采集及混沌特性研究系统中的高速数据通信，提出了一种采用FIFO缓存芯片实现AN2131Q与TMS320C5409的连接方法，深入研究了EZ-USB序列接口芯片的固件、设备驱动和用户程序开发过程。关键词：AN2131Q; TMS320C5409; IDT72V02；数据通信ABSTRACT: Using AN2131Q as the control chip, the communication BETWEEN DSP and PC in the underwater acoustic signal acquisition and chaotic characteristics study system is realized. The method is proposed that using FIFO to realize the connectivity BETWEEN AN2131Q and TMS320C5409. The development of programming Firmware、device driver and user application are thoroughly researched.Key words: AN2131Q; TMS320C5409; IDT72V02; data communication
上传时间： 2014-04-03
上传用户：hahayou
Tug of War(A tug of war is to be arranged at the local office picnic. For the tug of war, the picnickers must be divided into two teams. Each person must be on one team or the other the number of people on the two teams must not differ by more than 1 the total weight of the people on each team should be as nearly equal as possible. The first line of input contains n the number of people at the picnic. n lines follow. The first line gives the weight of person 1 the second the weight of person 2 and so on. Each weight is an integer BETWEEN 1 and 450. There are at most 100 people at the picnic. Your output will be a single line containing 2 numbers: the total weight of the people on one team, and the total weight of the people on the other team. If these numbers differ, give the lesser first. )
上传时间： 2014-01-07
上传用户：离殇
