FMUL in ASSEMBLY. Enjoy!
上传时间： 2013-12-17
上传用户：hewenzhi
Key logger in ASSEMBLY
上传时间： 2017-09-17
上传用户：jeffery
ASSEMBLY language program for programming adf7020 devices through pic16f628a
标签： programming ASSEMBLY language devices
上传时间： 2013-12-08
上传用户：zhuoying119
Arm ASSEMBLY Language Fundamentals and Techniques
标签： Arm ASSEMBLY Language Fundamentals and Techniques
上传时间： 2016-01-21
上传用户：laomaoze
Introduction to 80x86 ASSEMBLY Language and Computer Architecture_Richard Detmer_Jones and Bartlett Publishers_2001
标签： Introduction Architecture ASSEMBLY Computer Language 80x86 and to
上传时间： 2019-04-03
上传用户：zsx097
Visual ASSEMBLY是一个绿色免费的汇编语言编译器，该软件提供了编辑、编译、运行、调试汇编语言程序的集成环境。目前支持MASM、TASM、MCS51三种编译器。 汇编语言编译器Visual ASSEMBLY目录说明 bin目录里为本软件 files目录为汇编语言写的用于测试的程序 source目录为本软件的源代码 masm为MASM类型的编译器，其中：masm.exe为编译器，link.exe为连接器
标签： 汇编
上传时间： 2020-11-11
上传用户：
·详细说明：外挂硬盘和FLASH的MP3播放器解决方案，用C和汇编编写，并附带有电路原理图- Outside hangs the hard disk and the FLASH MP3 player solution, with C and the ASSEMBLY compilation, and has the electric circuit schematic diagram in pass
上传时间： 2013-06-12
上传用户：yangbo69
·【作 者】Ayala, Kenneth J. [同作者作品] 【出 版 社】 Thomson Learning 【书 号】 140186158X 【出版日期】 2005 年7月 【页 码】 412 本书全面论述8051系列的微控制器的内部结构、指令系统、寻址方式、存储分配以及与各种实际外围器件的接口技术
标签： nbsp Microcontroller Embedded ASSEMBLY
上传时间： 2013-04-24
上传用户：zhengzg
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The ASSEMBLY and sub-ASSEMBLY levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of ASSEMBLYtypes and complexities.
上传时间： 2014-12-23
上传用户：xinhaoshan2016
Advancements in board ASSEMBLY, PCB layout anddigital IC integration have produced a new generationof densely populated, high performance systems. Theboard-mounted point-of-load (POL) DC/DC power suppliesin these systems are subject to the same demandingsize, high power and performance requirements asother subsystems. The rigorous new POL demands aredifficult to meet with traditional controller or regulatorICs, or power modules.
上传时间： 2014-12-24
上传用户：lbbyxmraon
