PCB设计经验，多层PCB设计经验。
上传时间： 2013-11-07
上传用户：suoyuan
2007 Release Highlight CN高速电路设计。
上传时间： 2013-11-22
上传用户：467368609
ORCAD PSPICE 16.5crack文件,win7下亲测可用，内含详细破解过程和必要的文件
上传时间： 2013-11-15
上传用户：feifei0302
在PADS中锅仔片的制作方法
标签： PADS
上传时间： 2013-11-18
上传用户：michael20
让你的pcb更美观
上传时间： 2013-11-15
上传用户：CHINA526
CAM350教程：CAM350 v8.05学习资料 。
上传时间： 2013-11-23
上传用户：jinyao
利用allegro进行仿真时的线路参数设置
上传时间： 2013-11-10
上传用户：小眼睛LSL
介绍了采用protel 99se进行射频电路pcb设计的设计流程为了保证电路的性能。在进行射频电路pcb设计时应考虑电磁兼容性，因而重点讨论了元器件的布局与布线原则来达到电磁兼容的目的.关键词 射频电路 电磁兼容 布局
上传时间： 2013-11-14
上传用户：竺羽翎2222
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上传时间： 2013-11-10
上传用户：1595690
ORCAD基础培训
上传时间： 2013-11-14
上传用户：panpanpan
