The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi-
level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology
in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not
only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film
issues generated by severe topography, but also enables far greater flexibility with process complexity and associated
designs. T
