Failure analysis is invaluable in the learning process of electrostatic discharge (ESD) and
electrical overstress (EOS) protection design and development [1–8]. In the failure analysis
of EOS, ESD, and latchup events, there are a number of unique failure analysis processes
andinformationthatcanprovidesignificantunderstandingandillumination[4].Today,thereis
still no design methodology or computer-aided design (CAD) tool which will predict EOS,
ESDprotectionlevels,andlatchupinasemiconductorchip;thisisoneofthesignificantreasons
why failure analysis is critical to the ESD design discipline.
