OpenSVM was developped under Visual C++ 6.0 SP6, You can open the workspace file(*.dsw) in the opensvm-src folder. The folder include the svm.h and svm.cpp which in the libsvm (Copyright (c) 2000-2007 Chih-Chung Chang and Chih-Jen Lin All rights reserved) in the opensvm-src\libsvm. However, the files svm.h and svm.cpp codes were copied/merged into stdafx.h and stdafx.cpp in order to support the development, and OpenSVM still use other codes of libsvm. So you can see the libsvm package in the source package. You can open and build it with Visual C++ 6.0. Note: the problems must be in LIBSVM format. OpenSVM project page: http://sourceforge.net/projects/opensvm If you had any question, please mail to: cloudbyron@gmail.com
标签： developped the workspace OpenSVM
上传时间： 2016-01-30
上传用户：asdfasdfd
fpga open door,最最基础的入门介绍，针对首次接触此类的新手\r\n
上传时间： 2013-08-10
上传用户：daijun20803
PCB LAYOUT 術語解釋(TERMS)1. COMPONENT SIDE(零件面、正面)︰大多數零件放置之面。2. SOLDER SIDE(焊錫面、反面)。3. SOLDER MASK(止焊膜面)︰通常指Solder Mask Open 之意。4. TOP PAD︰在零件面上所設計之零件腳PAD，不管是否鑽孔、電鍍。5. BOTTOM PAD：在銲錫面上所設計之零件腳PAD，不管是否鑽孔、電鍍。6. POSITIVE LAYER：單、雙層板之各層線路；多層板之上、下兩層線路及內層走線皆屬之。7. NEGATIVE LAYER：通常指多層板之電源層。8. INNER PAD：多層板之POSITIVE LAYER 內層PAD。9. ANTI-PAD：多層板之NEGATIVE LAYER 上所使用之絕緣範圍，不與零件腳相接。10. THERMAL PAD：多層板內NEGATIVE LAYER 上必須零件腳時所使用之PAD，一般稱為散熱孔或導通孔。11. PAD (銲墊)：除了SMD PAD 外，其他PAD 之TOP PAD、BOTTOM PAD 及INNER PAD 之形狀大小皆應相同。12. Moat : 不同信號的 Power& GND plane 之間的分隔線13. Grid : 佈線時的走線格點2. Test Point : ATE 測試點供工廠ICT 測試治具使用ICT 測試點 LAYOUT 注意事項:PCB 的每條TRACE 都要有一個作為測試用之TEST PAD(測試點)，其原則如下：1. 一般測試點大小均為30-35mil，元件分布較密時，測試點最小可至30mil.測試點與元件PAD 的距離最小為40mil。2. 測試點與測試點間的間距最小為50-75mil，一般使用75mil。密度高時可使用50mil,3. 測試點必須均勻分佈於PCB 上，避免測試時造成板面受力不均。4. 多層板必須透過貫穿孔(VIA)將測試點留於錫爐著錫面上(Solder Side)。5. 測試點必需放至於Bottom Layer6. 輸出test point report(.asc 檔案powerpcb v3.5)供廠商分析可測率7. 測試點設置處:Setuppadsstacks
上传时间： 2013-10-22
上传用户：pei5
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上传时间： 2013-10-15
上传用户：busterman
返驰式(Flyback) 电源供应器是交换式电源设计供应器(Switch Power Supply，SPS)的一种，为工业界常用之电路架构，其特点如下表所示，图一所示为返驰式转换器(Flyback Converter)电路。 一般设计SPS需要一些保护来提高系统设备之稳定安全，尤其是输出过电压保护极为重要，这个输出过电压保护目的是防止电气设备上的元件之绝缘遭受过电压的破坏。一般过电压的测试方法是将回授Open让系统呈现段回路状况，导致一次侧能量无限制提供给二次测来达到输出过电压现象。
上传时间： 2013-11-06
上传用户：haoxiyizhong
Abstract: Stuxnet, a sophisticated virus that damaged Iran's nuclear capability, should be an eye openerfor the world. We can choose to learn something very narrow (how to combat the Stuxnet virus) or wecan choose to focus on the larger goal of thwarting the next type of creative cyber attack. Unfortunately,critical industrial infrastructure is not currently designed with security as a key goal, leaving open multipleavenues for an educated and funded attacker to create massive problems. This tutorial outlines somebasic concepts that engineers and product definers should consider to make sure their new projects stayahead of future threats.
上传时间： 2013-11-17
上传用户：llwap
本文档介绍如何使用PIC单片机编程器开发工具在目标电路板上仿真和调试固件。本手册的内容编排如下 第一章 PIC单片机编程器概述 第二章 入门 第三章 PIC编程器和ICSP 第四章 PICKIT DEBUG EXPRESS 第五章 疑难解答 ......................
上传时间： 2013-10-19
上传用户：sardinescn
遥控器使用方便, 功能多, 目前已广泛应用在电视机、、、空调等各种家用电器中, 且价格便宜, 市上非常容易买到。如果能将遥控器上许多的按键解码出来, 用作单片机系统的输入, 则解决了常规矩阵键盘线路板大、布线复杂、占用口过多的弊病。而且通过使用遥控器, 操作时可实现人与设备的分离, 从而更加方便使用。下面以下编码芯片的遥控器为例,谈谈如何用常用的系统单片机进行遥控的解码。
上传时间： 2013-10-15
上传用户：gxmm
任务1 广告灯电路的制作 任务2 音频控制电路的制作 任务3 继电器控制电路的制作 任务4 程序调试 任务5 程序烧写
上传时间： 2013-10-29
上传用户：ZOULIN58
MSP430和ARM7是两个完全不同体系构架的处理器，因此虽一些在应用上具有共性的问题做个简要比较。 目前在应用中比较普遍关心的是 速度和功耗、 应用范围、内部资源、硬件设计、设计周期、成本考虑
上传时间： 2013-10-22
上传用户：wenwiang
