The exacting technological demands created byincreasing bandwidth requirements have given riseto significant advances in FPGA technology thatenable engineers to successfully incorporate highspeedI/O interfaces in their designs. One aspect ofdesign that plays an increasingly important role isthat of the FPGA PACKage. As the interfaces get fasterand wider, choosing the right PACKage has becomeone of the key considerations for the systemdesigner.
上传时间： 2013-10-22
上传用户：1234xhb
The LPC2292/2294 microcontrollers are based on a 16/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, together with 256 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 pct with minimal performance penalty. With their 144-pin PACKage, low power consumption, various 32-bit timers, 8-channel 10-bit ADC, 2/4 (LPC2294) advanced CAN channels, PWM channels and up to nine external interrupt pins these microcontrollers are particularly suitable for automotive and industrial control applications as well as medical systems and fault-tolerant maintenance buses. The number of available fast GPIOs ranges from 76 (with external memory) through 112 (single-chip). With a wide range of additional serial communications interfaces, they are also suited for communication gateways and protocol converters as well as many other general-purpose applications. Remark: Throughout the data sheet, the term LPC2292/2294 will apply to devices with and without the /00 or /01 suffix. The suffixes /00 and /01 will be used to differentiate from other devices only when necessary.
上传时间： 2014-12-30
上传用户：aysyzxzm
superpro 3000u 驱动 PIC16C65B@QFP44 [SA245] PIC16C65B: Part number QFP44: PACKage in QFP44 SA245: Adapter purchase number AM29DL320GT@FBGA48 [SA642+B026] AM29DL320GT: Part number FBGA48: PACKage in FBGA48 SA642: Adapter purchase number (Top board with socket) B026: Adapter purchase number (Bottom board, exchangable for different parts) 87C196CA@PLCC68(universal adapter) [PEP+S414T] 87C196CA: Part number PLCC68: PACKage in PLCC68 universal adapter: this adapter is valid for all parts in this PACKage PEP: The PEP (Pin-driver Expansion Pack necessary to work with the adapter S414T) S414T: Adapter purchase number (Universal for all parts in this PACKage) S71PL127J80B@FBGA64(special adapter) [(SA642A-B079A-Y096AF001)] S71PL127J80B: Part number FBGA64: PACKage in FBGA64 special adapter: this adapter is valid for this
上传时间： 2013-10-23
上传用户：Avoid98
Abstract: Using a wafer-level PACKage (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
标签： Considerations Guidelines and Design
上传时间： 2013-11-09
上传用户：ls530720646
Introduction to Xilinx Packaging Electronic PACKages are interconnectable housings for semiconductor devices. The major functions of the electronic PACKages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor PACKages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving PACKage feature sizes down to the design rules of the early transistors. To meet these demands, electronic PACKages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,PACKages must be reliable and cost effective.
上传时间： 2013-11-21
上传用户：不懂夜的黑
This application note contains a reference design consisting of HDL IP and Xilinx AdvancedConfiguration Environment (ACE) software utilities that give designers great flexibility increating in-system programming (ISP) solutions. In-system programming support allowsdesigners to revise existing designs, PACKage the new bitstream programming files with theprovided software utilities, and update the remote system through the JTAG interface using theEmbedded JTAG ACE Player.
上传时间： 2013-10-22
上传用户：gai928943
The exacting technological demands created byincreasing bandwidth requirements have given riseto significant advances in FPGA technology thatenable engineers to successfully incorporate highspeedI/O interfaces in their designs. One aspect ofdesign that plays an increasingly important role isthat of the FPGA PACKage. As the interfaces get fasterand wider, choosing the right PACKage has becomeone of the key considerations for the systemdesigner.
上传时间： 2013-11-07
上传用户：wanghui2438
半導體的產品很多，應用的場合非常廣泛，圖一是常見的幾種半導體元件外型。半導體元件一般是以接腳形式或外型來劃分類別，圖一中不同類別的英文縮寫名稱原文為 PDID：Plastic Dual Inline PACKage SOP：Small Outline PACKage SOJ：Small Outline J-Lead PACKage PLCC：Plastic Leaded Chip Carrier QFP：Quad Flat PACKage PGA：Pin Grid Array BGA：Ball Grid Array 雖然半導體元件的外型種類很多，在電路板上常用的組裝方式有二種，一種是插入電路板的銲孔或腳座，如PDIP、PGA，另一種是貼附在電路板表面的銲墊上，如SOP、SOJ、PLCC、QFP、BGA。 從半導體元件的外觀，只看到從包覆的膠體或陶瓷中伸出的接腳，而半導體元件真正的的核心，是包覆在膠體或陶瓷內一片非常小的晶片，透過伸出的接腳與外部做資訊傳輸。圖二是一片EPROM元件，從上方的玻璃窗可看到內部的晶片，圖三是以顯微鏡將內部的晶片放大，可以看到晶片以多條銲線連接四周的接腳，這些接腳向外延伸並穿出膠體，成為晶片與外界通訊的道路。請注意圖三中有一條銲線從中斷裂，那是使用不當引發過電流而燒毀，致使晶片失去功能，這也是一般晶片遭到損毀而失效的原因之一。 圖四是常見的LED，也就是發光二極體，其內部也是一顆晶片，圖五是以顯微鏡正視LED的頂端，可從透明的膠體中隱約的看到一片方型的晶片及一條金色的銲線，若以LED二支接腳的極性來做分別，晶片是貼附在負極的腳上，經由銲線連接正極的腳。當LED通過正向電流時，晶片會發光而使LED發亮，如圖六所示。 半導體元件的製作分成兩段的製造程序，前一段是先製造元件的核心─晶片，稱為晶圓製造；後一段是將晶中片加以封裝成最後產品，稱為IC封裝製程，又可細分成晶圓切割、黏晶、銲線、封膠、印字、剪切成型等加工步驟，在本章節中將簡介這兩段的製造程序。
上传时间： 2013-11-04
上传用户：372825274
SL811开发资料_包含源程序_电路图_芯片资料:SL811HS Embedded USB Host/Slave Controller.The SL811HS is an Embedded USB Host/Slave Controller capable of communicate with either full-speed or low-speed USB peripherals. The SL811HS can interface to devices such as microprocessors, microcontrollers, DSPs, or directly to a variety of buses such as ISA, PCMCIA, and others. The SL811HS USB Host Controller conforms to USB Specification 1.1.The SL811HS USB Host/Slave Controller incorporates USB Serial Interface functionality along with internal full-/low-speed transceivers.The SL811HS supports and operates in USB full-speed mode at 12 Mbps, or at low-speed 1.5-Mbps mode.The SL811HS data port and microprocessor interface provide an 8-bit data path I/O or DMA bidirectional, with interrupt support to allow easy interface to standard microprocessors or microcontrollers such as Motorola or Intel CPUs and many others. Internally,the SL811HS contains a 256-byte RAM data buffer which is used for control registers and data buffer.The available PACKage types offered are a 28-pin PLCC (SL811HS) and a 48-pin TQFP PACKage (SL811HST-AC). Both PACKages operate at 3.3 VDC. The I/O interface logic is 5V-tolerant.
上传时间： 2013-12-22
上传用户：a82531317
superpro 3000u 驱动 PIC16C65B@QFP44 [SA245] PIC16C65B: Part number QFP44: PACKage in QFP44 SA245: Adapter purchase number AM29DL320GT@FBGA48 [SA642+B026] AM29DL320GT: Part number FBGA48: PACKage in FBGA48 SA642: Adapter purchase number (Top board with socket) B026: Adapter purchase number (Bottom board, exchangable for different parts) 87C196CA@PLCC68(universal adapter) [PEP+S414T] 87C196CA: Part number PLCC68: PACKage in PLCC68 universal adapter: this adapter is valid for all parts in this PACKage PEP: The PEP (Pin-driver Expansion Pack necessary to work with the adapter S414T) S414T: Adapter purchase number (Universal for all parts in this PACKage) S71PL127J80B@FBGA64(special adapter) [(SA642A-B079A-Y096AF001)] S71PL127J80B: Part number FBGA64: PACKage in FBGA64 special adapter: this adapter is valid for this
上传时间： 2014-03-27
上传用户：ippler8
