The PCA9670 provides general purpose remote I/O expansion for most microcontrollerfamilies via the two-line bidirectional bus (I2C-bus) and is a part of the Fast-mode Plusfamily.The PCA9670 is a drop-in upgrade for the PCF8574 providing higher Fast-mode Plus(Fm+) I2C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWMdimming of LEDs, higher I2C-bus drive (30 mA versus 3 mA) so that many more devicescan be on the bus without the need for bus buffers, higher total PACKage sink capacity(200 mA versus 100 mA) that supports having all 25 mA LEDs on at the same time andmore device addresses (64 versus 8) are available to allow many more devices on the buswithout address conflicts.
上传时间： 2013-10-15
上传用户：stella2015
The PCA9671 provides general purpose remote I/O expansion for most microcontrollerfamilies via the two-line bidirectional bus (I2C-bus) and is a part of the Fast-mode Plus(Fm+) family.The PCA9671 is a drop in upgrade for the PCF8575 providing higher I2C-bus speeds(1 MHz versus 400 kHz) so that the output can support PWM dimming of LEDs, higherI2C-bus drive (30 mA versus 3 mA) so that many more devices can be on the bus withoutthe need for bus buffers, higher total PACKage sink capacity (400 mA versus 100 mA) thatsupports having all 25 mA LEDs on at the same time and more device addresses (64versus 8) to allow many more devices on the bus without address conflicts.
上传时间： 2013-10-12
上传用户：laomv123
The PCA9672 provides general purpose remote I/O expansion for most microcontrollerfamilies via the two-line bidirectional bus (I2C-bus) and is a part of the Fast-mode Plusfamily.The PCA9672 is a drop-in upgrade for the PCF8574 providing higher Fast-mode Plus(Fm+) I2C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWMdimming of LEDs, higher I2C-bus drive (30 mA versus 3 mA) so that many more devicescan be on the bus without the need for bus buffers, higher total PACKage sink capacity(200 mA versus 100 mA) that supports having all LEDs on at the same time and moredevice addresses (16 versus 8) are available to allow many more devices on the buswithout address conflicts.
上传时间： 2013-10-23
上传用户：jasonheung
The PCA9673 provides general purpose remote I/O expansion for most microcontrollerfamilies via the two-line bidirectional bus (I2C-bus) and is a part of the Fast-mode Plusfamily.The PCA9673 is a drop in upgrade for the PCF8575 providing higher Fast-mode Plus(Fm+) I2C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWMdimming of LEDs, higher I2C-bus drive (30 mA versus 3 mA) so that many more devicescan be on the bus without the need for bus buffers, higher total PACKage sink capacity(400 mA versus 100 mA) that supports having all 25 mA LEDs on at the same time andmore device addresses (16 versus 8) are available to allow many more devices on the buswithout address conflicts.
上传时间： 2013-10-29
上传用户：wkchong
The PCA9674/74A is a drop-in upgrade for the PCF8574/74A providing higher Fast-modePlus I2C-bus speeds (1 MHz versus 400 kHz) so that the output can support PWMdimming of LEDs, higher I2C-bus drive (30 mA versus 3 mA) so that many more devicescan be on the bus without the need for bus buffers, higher total PACKage sink capacity(200 mA versus 100 mA) that supports having all LEDs on at the same time and moredevice addresses (64 versus 8) are available to allow many more devices on the buswithout address conflicts.
上传时间： 2013-10-22
上传用户：wwwwwen5
The Motorola MPC106 PCI bridge/memory controller provides a PowerPCªmicroprocessor common hardware reference platform (CHRPª) compliant bridgebetween the PowerPC microprocessor family and the Peripheral Component Interconnect(PCI) bus. In this document, the term Ô106Õ is used as an abbreviation for the phraseÔMPC106 PCI bridge/memory controllerÕ. This document contains pertinent physicalcharacteristics of the 106. For functional characteristics refer to theMPC106 PCI Bridge/Memory Controller UserÕs Manual.This document contains the following topics:Topic PageSection 1.1, ÒOverviewÓ 2Section 1.2, ÒFeaturesÓ 3Section 1.3, ÒGeneral ParametersÓ 5Section 1.4, ÒElectrical and Thermal CharacteristicsÓ 5Section 1.5, ÒPin AssignmentsÓ 17Section 1.6, ÒPinout Listings 18Section 1.7, ÒPACKage DescriptionÓ 22Section 1.8, ÒSystem Design InformationÓ 24Section 1.9, ÒDocument Revision HistoryÓ 29Section 1.10, ÒOrdering InformationÓ 29
上传时间： 2013-11-04
上传用户：as275944189
The 87LPC76X Microcontroller combines in a small PACKage thebenefits of a high-performance microcontroller with on-boardhardware supporting the Inter-Integrated Circuit (I2C) bus interface.The 87LPC76X can be programmed both as an I2C bus master, aslave, or both. An overview of the I2C bus and description of the bussupport hardware in the 87LPC76X microcontrollers appears inapplication note AN464, Using the 87LPC76X Microcontroller as anI2C Bus Master. That application note includes a programmingexample, demonstrating a bus-master code. Here we show anexample of programming the microcontroller as an I2C slave.The code listing demonstrates communications routines for the87LPC76X as a slave on the I2C bus. It compliments the program inAN464 which demonstrates the 87LPC76X as an I2C bus master.One may demonstrate two 87LPC76X devices communicating witheach other on the I2C bus, using the AN464 code in one, and theprogram presented here in the other. The examples presented hereand in AN464 allow the 87LPC76X to be either a master or a slave,but not both. Switching between master and slave roles in amultimaster environment is described in application note AN435.The software for a slave on the bus is relatively simple, as theprocessor plays a relatively passive role. It does not initiate bustransfers on its own, but responds to a master initiating thecommunications. This is true whether the slave receives or transmitsdata—transmission takes place only as a response to a busmaster’s request. The slave does not have to worry about arbitrationor about devices which do not acknowledge their address. As theslave is not supposed to take control of the bus, we do not demandit to resolve bus exceptions or “hangups”. If the bus becomesinactive the processor simply withdraws, not interfering with themaster (or masters) on the bus which should (hopefully) try toresolve the situation.
上传时间： 2013-11-19
上传用户：shirleyYim
摘 要 瞬态仿真领域的许多工作需要获得可视化数据, 仿真电路不能将输出参数绘制成图形时研究工作将受到很大影响. 而权威电路仿真软件PSpice 在这个方面不尽如人意. 本文提出了一种有效的解决办法: 通过MATLAB 编程搭建一个PSpice 与MATLAB 的数据接口,使PSpice输出数据文件可以导入到MATLAB中绘制图形. 这令我们能够很方便地获得数据的规律以有效地分析仿真结果, 这项技术对于教学和工程实践都有比较实际的帮助.关键词: 瞬态仿真 仿真程序 PSpice MATLAB 可视化数据The Data Transfer from Pspice to MATLABWu hao Ning yuanzhong Liang yingAbstract Many works in the area of transient simulation has shown how a emulator such asPSpice can be interfaced to an control analysis PACKage such as MATLAB to get viewdata. Thepaper describes how such interfaces can be made using the MATLAB programming. The platformas a typical platform will solve the problem that PSpice software sometimes can not draw the datato a picture. It can make us find the rule from numerous data very expediently, so we can analyzethe outcome of the simulation. And it also can be used in the field of education.Keywords Transient Simulation Emulator PSpice MATLAB Viewdata1 引言科学研究和工程应用常需要进行电路仿真 PSpice可进行直流 交流 瞬态等基本电路特性分析 也可进行蒙托卡诺 MC 统计分析 最坏情况 Wcase 分析 优化设计等复杂电路特性分析 它是国际上仿真电路的权威软件 而MATLAB的主要特点有 高效方便的矩阵和数组运算 编程效率高 结构化面向对象 方便的绘图功能 用户使用方便 工具箱功能强大 两者各有着重点 两种软件结合应用 对研究工作有很重要的意义香港理工大学Y. S. LEE 等人首先将PSpice和MATLAB结合 开发了电力电子电路优化用的CAD 程序MATSPICE[6] 将两者相结合的关键在于 如何用MATLAB 获取PSpice的仿真数据 对此参考文献 6 里没有详细叙述 本文着重说明用MATLAB 读取PSpice仿真数据的具体方法本论文利用MATLAB对PSpice仿真出的数据处理绘制出后者无法得到或是效果不好的仿真图形 下面就两者结合使用的例子 进行具体说明
上传时间： 2013-10-20
上传用户：wuchunzhong
Introduction to Xilinx Packaging Electronic PACKages are interconnectable housings for semiconductor devices. The major functions of the electronic PACKages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor PACKages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving PACKage feature sizes down to the design rules of the early transistors. To meet these demands, electronic PACKages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,PACKages must be reliable and cost effective.
上传时间： 2013-10-22
上传用户：ztj182002
This application note contains a reference design consisting of HDL IP and Xilinx AdvancedConfiguration Environment (ACE) software utilities that give designers great flexibility increating in-system programming (ISP) solutions. In-system programming support allowsdesigners to revise existing designs, PACKage the new bitstream programming files with theprovided software utilities, and update the remote system through the JTAG interface using theEmbedded JTAG ACE Player.
上传时间： 2013-11-14
上传用户：JIMMYCB001
