虫虫首页| 资源下载| 资源专辑| 精品软件
登录| 注册

您现在的位置是:虫虫下载站 > 资源下载 > 教程资料 > Xilinx UltraScale:新一代架构满足您的新一代架构需求(EN)

Xilinx UltraScale:新一代架构满足您的新一代架构需求(EN)

  • 资源大小:975 K
  • 上传时间: 2013-11-13
  • 上传用户:royn
  • 资源积分:2 下载积分
  • 标      签: UltraScale Xilinx 架构

资 源 简 介

  中文版详情浏览http://www.elecfans.com/emb/fpga/20130715324029.html

  Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture

   The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications.

  The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation.

  Some of the UltraScale architecture breakthroughs include:

  • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50%

   • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability

  • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization

  • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard

   • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets

  • Greatly enhanced DSP and packet handling

  The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.

相 关 资 源